Browsing by Author "Coenen, David"
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Publication A Critical Analysis of the Thermo-Optic Time Constant in Si Photonic Devices
Journal article2024, PHOTONICS, (11) 7, p.Art. 603Publication Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models
Journal article2022-08-03, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, (12) 8, p.1350-1357Publication Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
Journal article2023, IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, (42) 7, p.2264-2275Publication Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator
; ; ; ; ; Proceedings paper2023, International Conference on Photonics in Switching and Computing (PSC), SEP 26-29, 2023Publication Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis
Journal article2023, JOURNAL OF LIGHTWAVE TECHNOLOGY, (41) 18, p.6000-6006Publication Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators
Journal article2022-07-01, IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, (22) 3, p.417-423Publication Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography
Journal article2024, JOURNAL OF FAILURE ANALYSIS AND PREVENTION, (24) 5, p.2129-2141Publication Thermal Characterisation of Hybrid, Flip-Chip InP-Si DFB Lasers
Journal article2023-02-03, MICROMACHINES, (14) 2, p.Art. 381Publication Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers
Journal article2024, JOURNAL OF OPTICAL MICROSYSTEMS, (4) 1, p.Art. 011004Publication Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)
Journal article correction2024Publication Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut
Journal article2022-07-01, JOURNAL OF LIGHTWAVE TECHNOLOGY, (40) 13, p.4357-4363Publication Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
Journal article2023, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, (29) 6, p.Art. 8200311