Browsing by Author "Coenen, David"
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Publication A Critical Analysis of the Thermo-Optic Time Constant in Si Photonic Devices
Journal article2024, PHOTONICS, (11) 7, p.Art. 603Publication Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models
Journal article2022, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, (12) 8, p.1350-1357Publication Analytical Model for Cu Interconnect Lifetimes Under Combined Thermomigration and Electromigration Stress
Journal article2025, IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, (25) 4, p.983-993Publication Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
Journal article2023, IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, (42) 7, p.2264-2275Publication Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator
; ; ; ; ; Proceedings paper2023, International Conference on Photonics in Switching and Computing (PSC), SEP 26-29, 2023Publication De-coupling Thermo-migration from Electromigration using a dedicated test structure
Proceedings paper2024, International Reliability Physics Symposium (IRPS), 2024-04-14Publication Degradation Mechanisms of Monolithic GaAs-on-Si Nano-Ridge Quantum Well Lasers
Journal article2025, JOURNAL OF LIGHTWAVE TECHNOLOGY, (43) 12, p.5811-5819Publication Do's and don'ts for SiPho heater qualification
Proceedings paper2025, 2025 Conference on Smart Photonic and Optoelectronic Integrated Circuits, 2025-03-19, p.1337007-1-1337007-4Publication Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis
Journal article2023, JOURNAL OF LIGHTWAVE TECHNOLOGY, (41) 18, p.6000-6006Publication Electro-Opto-Thermal Dynamic Compact Model for Ring Modulator Arrays
Journal article2025, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, (15) 5, p.1006-1013Publication Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators
Journal article2022, IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, (22) 3, p.417-423Publication Electrothermal Modeling of GaAs Nanoridge Laser Diodes
; ; ; ; ; Journal article2025, IEEE TRANSACTIONS ON ELECTRON DEVICES, (72) 9, p.5038-1-5038-7Publication Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography
Journal article2024, JOURNAL OF FAILURE ANALYSIS AND PREVENTION, (24) 5, p.2129-2141Publication O-Band Silicon Ring Modulators With Highly Efficient Electro- and Thermo-Optic Modulation
Journal article2025, JOURNAL OF LIGHTWAVE TECHNOLOGY, (43) 3, p.1328-1334Publication Thermal Characterisation of Hybrid, Flip-Chip InP-Si DFB Lasers
Journal article2023, MICROMACHINES, (14) 2, p.Art. 381Publication Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers
Journal article2024, JOURNAL OF OPTICAL MICROSYSTEMS, (4) 1, p.Art. 011004Publication Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)
Journal article correction2024, JOURNAL OF OPTICAL MICROSYSTEMS, (4) 1, p.019801Publication Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut
Journal article2022, JOURNAL OF LIGHTWAVE TECHNOLOGY, (40) 13, p.4357-4363Publication Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics
Journal article2025, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, (31) 2, p.1501009Publication Thermo-Optical Analysis of O-Band GeSi Quantum Confined Stark Effect Electro-Absorption Modulators
Journal article2025, IEEE PHOTONICS TECHNOLOGY LETTERS, (37) 17, p.977-980