Browsing by Author "De Preter, Inge"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

3D stacking of Co and Ni based microbumps

3D stacking using bump-less process for sub 10μm pitches

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications

Co-Sn intermetallic compoundsfor potential integration in 3D interconnects

Cobalt UBM for fine pitch microbump applications in 3DIC

Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking

Confined IMCs for low temperature and high throughput D2W bonding

Die to wafer 3D stacking for below 10μm pitch microbumps

ELD NiB for microbumps passivation and wirebonding

Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn

Impact of ELD layers in mechanical properties of microbumps for 3D stacking

Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems

Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings

Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking