Browsing by Author "Driessens, Evelien"
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Publication A fast and flexible thermal simulation tool validated on smart power devices
Proceedings paper2005-05, Proceedings International Symposium on Power Semiconductor Devices - ISPSD, 23/05/2005, p.111-114Publication Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Proceedings paper2001, Proceedings of the SMTA Conference; 30 Sept. - 4 October 2001; Chicago, IL, USA., p.431-468Publication Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
Proceedings paper2005-04, Proceedings International Reliability Physics Symposium, 17/04/2005, p.652-653Publication Design and characterization of a post-processed copper heat sink for smart power drivers
Proceedings paper2005-04, IEEE International Conference on Microelectronic Test Structures, 4/04/2005, p.27-31Publication Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies
Proceedings paper2002, Proceedings of the 8th International Workshop on Thermal Investigations of ICs and Systems - Therminic, 1/10/2002, p.46-49Publication Factors involved in performance optimisation of GHz chip-package co-design
Proceedings paper2004-11, Proceedings 37th IMAPS International Symposium on Microelectronics, 14/11/2004Publication Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Journal article2003, IEEE Trans. Electronics Packaging Manufacturing, (26) 1, p.54-67Publication Modeling of energy capability of power devices with copper layer integration
Proceedings paper2005-09, Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices - SISPAD, 1/09/2005, p.207-210Publication Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Proceedings paper2001, Proceedings 51st Electronic Components and Technology Conference - ECTC, 29/05/2001, p.141-148Publication Parametric compact models for the 72-pins polymer stud grid array (Tm)
Journal article2001, Microelectronics Journal, (32) 10_11, p.839-846Publication Parametric compact models for the 72-pins Polymer Stud Grid ArrayTM
Proceedings paper2000, Proceedings of the 6th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 24/09/2000, p.205-210Publication Polymer Stud Grid Array, a lead-free and economic CSP
Journal article2001, On Board Technology, November, p.56-60Publication Reliability assessment for the Polymer Stud Grid Array (PSGA) package
Oral presentation2000, 37th IMAPS Nordic ConferencePublication The PSGA, a lead-free CSP for high performance & high reliable packaging
Proceedings paper2001, Conference Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, 30/05/2001, p.435-440Publication The PSGA, a lead-free CSP for high performance and high reliable packaging
Proceedings paper2001, Proceedings of the IMAPS Conference, 9/10/2001, p.260-265Publication The Submerged Double Jet Impingement (SDJI) method for thermal testing of packages
Publication Thermal investigation of local temperature increase of GaAs substrates under incident laser beam
Proceedings paper2003, Proceedings of THERMINIC - The 9th International Workshop on Thermal Investigations of ICs and Systems, 23/09/2003, p.145-148Publication Transient thermal characterization of the polymer stud grid array(tm)
Journal article2001, IEEE Trans. Components and Packaging Technologies, (24) 4, p.554-558Publication Transient thermal characterization of the Polymer Stud Grid ArrayTM
Proceedings paper2000, Proceedings of the 6th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 24/09/2000, p.225-229