Browsing by Author "Forester, Lynn"
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Publication Characterization and process integration of a low-k spin-on dielectric
Publication Development of a global planarization process without CMP
Proceedings paper1994, 11th VLSI Multilevel Interconnect Conference - VMIC, 07/06/1994, p.172-178Publication Development of a non-destructive thin film porosimetry: pore size distribution and pore volume of porous silica
Proceedings paper1999, Advanced Metallization Conference in 1998. Proceedings of the Conference;, p.507-512Publication Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.59-61Publication Improved hot-carrier reliability in a 0.5-µm TLM CMOS process by back-end process optimization
Proceedings paper1994, 24th European Solid State Device Research Conference - ESSDERC, 11/09/1994, p.303-306Publication Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure
Proceedings paper1999, Advanced Metallization Conference in 1998 - AMC 1998, 6/10/1998, p.491-497Publication Interlevel dielectric engineering for improved device performance in half-micron CMOS
Proceedings paper1994, 11th VLSI Multilevel Interconnect Conference - VMIC, 07/06/1994, p.111-113