Browsing by Author "Goel, Sandeep K."
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Publication Automated design-for-test for 2.5D and 3D SICs
Journal article2011-09, Chip Scale Review, (?) 5, p.18-22Publication Automation of 3D DfT insertion and interconnect test generation
Oral presentation2011, IEEE International Test Conference - ITCPublication Automation of 3D-DfT insertion
Proceedings paper2011-11, IEEE Asian Test Symposium - ATS, 21/11/2011Publication Automation of 3D-DfT insertion
Proceedings paper2011-09, IEEE International Workshop on Testing Three-Dimensional Stacked ICs- 3D-TEST, 22/09/2011Publication DfT architecture and ATPG for interconnect tests of JEDEC wide-IO memory-on-logic die stacks
;Deutsch, Sergej ;Keller, Brion ;Chickermane, Vivek ;Mukherjee, SubhasishSood, NavdeepProceedings paper2012-11, IEEE International Test Conference - ITC, 6/11/2012, p.1-10Publication DfT insertion and interconnect test generation for 3D stacks with JEDEC wide-IO DRAM
Proceedings paper2012-05, IEEE North-Atlantic Test Workshop - NATW, 9/05/2012Publication Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base
Proceedings paper2011-11, IEEE Asian Test Symposium - ATS, 21/11/2011Publication Test and debug strategy for TSMC CoWoS stacking process-based heterogeneous 3D-IC: A silicon study
;Goel, Sandeep K. ;Adham, Saman ;Wang, Min-Jer ;Lee, Frank ;Chickermane, VivekKeller, BrionBook chapter2019-03Publication Test-architecture optimization and test scheduling for TSV-based 3D stacked ICs
Journal article2011-11, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, (30) 11, p.1705-1718Publication Testing of SOCs with hierarchical cores: common fallacies, test-access optimization, and test scheduling
Journal article2009, IEEE Transactions on Computers, (58) 3, p.409-423