Browsing by Author "Heerman, M."
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Publication Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Proceedings paper2001, Proceedings of the SMTA Conference; 30 Sept. - 4 October 2001; Chicago, IL, USA., p.431-468Publication Compact transient thermal models for the polymer stud grid array (PSGATM) package
Oral presentation1997, Eurotherm Seminar 58: Thermal Management of Electronic SystemsPublication Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
Oral presentation1999, Area Array Packaging Technologies WorkshopPublication Improved solder joint reliability in polymer stud grid array packages by structural design optimisation
Oral presentation1996, Weichlöten in Forschung und PraxisPublication Local stress analysis on polymer sud grid array (PSGA) packages by raman spectroscopy and FEM simulation
Proceedings paper2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.209-214Publication Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Oral presentation1997, Eurotherm Seminar 58: Thermal Management of Electronic SystemsPublication Parametric compact models for the 72-pins polymer stud grid array (Tm)
Journal article2001, Microelectronics Journal, (32) 10_11, p.839-846Publication Parametric compact models for the 72-pins Polymer Stud Grid ArrayTM
Proceedings paper2000, Proceedings of the 6th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 24/09/2000, p.205-210Publication Polymer Stud Grid Array, a lead-free and economic CSP
Journal article2001, On Board Technology, November, p.56-60Publication Reliability assessment for the Polymer Stud Grid Array (PSGA) package
Oral presentation2000, 37th IMAPS Nordic ConferencePublication The Plastic Stud Grid Array, a low cost solution for packaging and assembling high pin count devices
Proceedings paper1995, IEEE CPMT Workshop on Flip Chip and Ball Grid Arrays, 13/11/1995Publication The polymer stud grid array package
Oral presentation1996, International Symposium "Die Oberflächentechnik heute und morgen"Publication The polymer stud grid array package
Proceedings paper1996, Proceedings of the 1996 International Electronics Packaging Conference IEPS, 29/09/1996, p.213-223Publication The PSGA, a lead-free CSP for high performance and high reliable packaging
Proceedings paper2001, Proceedings of the IMAPS Conference, 9/10/2001, p.260-265Publication The stud grid array, a low cost solution for packaging and assembling high pin count devices
Proceedings paper1995, VLSI Packaging Workshop: Spotlight BGA, 16/10/1995, p.70-72Publication Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
Proceedings paper1997, Thermal Management of Electronic Systems II. Proceedings of EUROTHERM Seminar No 45, 20/09/1995, p.339-348Publication Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package
Proceedings paper1999, Proceedings of the 12th European Microelectronics and Packaging Conference, 7/06/1999, p.392-398Publication Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
Proceedings paper1999, Proceedings of the Electronic Components and Technology Conference - ECTC, 1/06/1999, p.823-829Publication Thermal modelling of polymer stud grid array (PSGA) package
Journal article1998, IMAPS International Journal of Microcircuits and Electronic Packaging, (20) 4, p.521-532