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Browsing by Author "Himcinschi, C."

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    Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-K SiO2 xerogel films

    Murray, C.
    ;
    Flannery, C.
    ;
    Streiter, I.
    ;
    Schulz, S. E.
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    Baklanov, Mikhaïl
    ;
    Mogilnikov, K. P.
    Journal article
    2002, Microelectronic Engineering, (60) 1_2, p.133-141
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    Comparison of techniques to characterize the density, porosity and elastic modules of porous low-k SiO2 xerogel films

    Murray, C.
    ;
    Flannery, C.
    ;
    Streiter, I.
    ;
    Schulz, S. E.
    ;
    Baklanov, Mikhaïl
    ;
    Mogilnikov, K. P.
    Oral presentation
    2001, MAM - European Workshop on Materials for Advanced Metallization; 5-7 March 2001; Sigtuna, Sweden.
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    Ellipsometric study of the change in the porosity of silica xerogels after chemical modification of the surface with hexamethyldisilazane

    Himcinschi, C.
    ;
    Friedrich, M.
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    Frühauf, S.
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    Streiter, I.
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    Schulz, S.E.
    ;
    Gessner, T.
    Journal article
    2002, Analytical and Bioanalytical Chemistry, 374, p.654-657
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    Ellipsometric study of the change in the porosity of silica xerogels after surface chemical modification with hexamethyldisilizane

    Himcinschi, C.
    ;
    Friedrich, M.
    ;
    Frühauf, S.
    ;
    Streiter, I.
    ;
    Schulz, S. E.
    ;
    Gessner, T.
    Oral presentation
    2001, 11. Tagung Festkörperanalytik. 11th Conference on Solid State Analytics; 25-28 June 2001; Chemnitz.
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    Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance

    Fruhauf, S.
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    Himcinschi, C.
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    Rennau, M.
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    Schulze, K.
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    Schulz, S.E.
    ;
    Friedrich, M.
    ;
    Gessner, T.
    Journal article
    2005, Microelectronic Engineering, (82) 3_4, p.405-410
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    Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation

    Reiche, M.
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    Moutanabbir, O.
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    Himcinschi, C.
    ;
    Christiansen, S.
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    Erfurth, E.
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    Goesele, U.
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    Mantl, S.
    Proceedings paper
    2008, Semiconductor Wafer Bonding 10: Science, Technology, and Applications, 12/10/2008, p.311-320
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    Strained silicon-on-insulator : fabrication and characterization

    Reiche, M.
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    Himcinschi, C.
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    Goesele, U.
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    Christiansen, S.
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    Mantl, S.
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    Buca, D.
    ;
    Zhao, Q. T.
    ;
    Feste, S.
    Proceedings paper
    2007, Silicon-on-Insulator Technology and Devices 13, 6/05/2007, p.339-344

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