Browsing by Author "Honore, Mia"
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Publication An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
; ; ; ; Proceedings paper2018, 7th Electronic System-Integration Technology Conference - ESTC, 18/09/2018, p.1-8Publication Copper plating for 3D interconnects
Journal article2011, Microelectronic Engineering, (88) 5, p.701-704Publication Electrodeposition for 3D integration
Proceedings paper2010, Symposium " Galvanik " Eine etablierte Technik innovativ angewendet, 25/11/2010, p.31-36Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
; ; ; ; Journal article2017, Chip Scale Review, (21) 1, p.28-32Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
Meeting abstract2016, 13th Annual International Wafer-Level Packaging Conference - IWLPC, 18/10/2016Publication Height uniformity of micro-bumps electroplated on thin Cu seed layers
Meeting abstract2016, 229th Electrochemical Society Meeting, 29/05/2016, p.1179Publication Height uniformity of micro-bumps electroplated on thin Cu seed layers
Proceedings paper2016, Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6, 29/05/2016, p.145-152Publication Metallization for 3D interconnect processing
Meeting abstract2012, ECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2717Publication Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Proceedings paper2019, 22nd European Microelectronics and Packaging Conference (EMPC), 16/09/2019Publication TSV Cu plating and implications for CMP
Meeting abstract2010, 218th Electrochemical Society Meeting, 10/10/2010, p.1991Publication TSV Cu plating and implications for CMP
Proceedings paper2011, Electronics and 3-D Packaging 4, 10/10/2011, p.11-21Publication Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Journal article2011, Journal of the Electrochemical Society, (158) 2, p.H160-H165