Browsing by Author "Hou, Lin"
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Publication 10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.617-622Publication 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication 3D stacking of Co and Ni based microbumps
; ; ; ; Publication 3D stacking using bump-less process for sub 10μm pitches
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.128-133Publication A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Proceedings paper2017, IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - IEEE S3S, 16/10/2017, p.7.4Publication A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 26/05/2020Publication A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking
Journal article2020, IEEE Transactions on Components, Packaging and Manufacturing Technology, (10) 4, p.669-678Publication A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.1442-1447Publication A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring
Journal article2020, IEEE Transactions on Components, Packaging and Manufacturing Technology, (10) 1, p.30-38Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
; ; ; ; Proceedings paper2018, 7th Electronic System-Integration Technology Conference - ESTC, 18/09/2018, p.1-8Publication Cobalt UBM for fine pitch microbump applications in 3DIC
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.221-224Publication Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Meeting abstract2017, Materials for Advanced Metallization Conference - MAM, 26/03/2017Publication Die to wafer 3D stacking for below 10μm pitch microbumps
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 9/11/2016, p.1-4Publication ELD NiB for microbumps passivation and wirebonding
Proceedings paper2020, 8th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 15-18, 2020Publication Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Meeting abstract2020, Electrochemical Society Spring Meeting Symposium E03: Electrodeposition of Alloys, Intermetallic Compounds, and Eutectics, 10/05/2020Publication Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/07/2017, p.1-3Publication Impact of ELD layers in mechanical properties of microbumps for 3D stacking
Proceedings paper2016, 6th Electronics System-Integration Technology Conference - ESTC, 13/09/2016, p.1-5Publication Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack
Proceedings paper2020, imaps MiNaPAD2020, 27/05/2020Publication Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Meeting abstract2017, Materials for Advanced MetallizationConference - MAM, 26/03/2017