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Browsing by Author "Kim, Tae-Gon"

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    Acidic cleaning solutions for post InGaAs CMP cleaning

    Park, Jin-Goo
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    Purushothaman, Muthukrishnan
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    Lee, Jung-Hwan
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    Choi, In-chan
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    Kim, Hyun-Tae
    Proceedings paper
    2018-04, 20th Surface Preparation and Cleaning Conference - SPCC 2018, 9/04/2018
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    Acoustic cleaning in nano-electronics

    Mertens, Paul  
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    Janssens, Tom
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    Holsteyns, Frank  
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    Zijlstra, Aaldert
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    Halder, Sandip  
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    Wostyn, Kurt  
    Proceedings paper
    2008, Acoustics, 29/06/2008, p.556-560
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    Analyzing the collapse force determined using lateral force AFM using

    Wostyn, Kurt  
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    Kim, Tae-Gon
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    Park, Jin-Goo
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    Mertens, Paul  
    Meeting abstract
    2008, Ultra Clean Processing of Semiconductor Surfaces 2008, 22/09/2008
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    Analyzing the collapse force determined using lateral force AFM using mechanics theory

    Wostyn, Kurt  
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    Kim, Tae-Gon
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    Park, Jin-Goo
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    Mertens, Paul  
    Oral presentation
    2008, 9th International Symposium on Ultra Clean Processing Of Semiconductor Surfaces
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    Analyzing the collapse force of narrow lines measured by lateral force AFM using an analytical mechanical model

    Wostyn, Kurt  
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    Kim, Tae-Gon
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    Mertens, Paul  
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    Park, Jin-Goo
    Journal article
    2009, Solid State Phenomena, 145-146, p.55-58
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    Atomic resolution quality control for Fin oxide recess by atomic resolution profiler

    Kim, Tae-Gon
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    Ryu, Heon-Yul  
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    Kenis, Karine  
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    Jo, Ah-jin
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    Cho, Sang-Joon
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    Park, Sang-il
    Proceedings paper
    2016, Ultra Clean Processing of Semiconductor Surfaces XIII - UCPSS, 11/09/2016, p.304-308
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    Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

    Mertens, Paul  
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    Kim, Tae-Gon
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    Claes, Martine  
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    Le, Quoc Toan  
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    Vereecke, Guy  
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    Kesters, Els  
    Proceedings paper
    2009, IEEE International Interconnect Technology Conference - IITC, 1/06/2009, p.237-239
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    Characterization of low-k dielectric etch residue on the sidewall by chemical force microscope

    Kim, Tae-Gon
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    Le, Quoc Toan  
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    Suhard, Samuel  
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    Lux, Marcel  
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    Vereecke, Guy  
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    Claes, Martine  
    Meeting abstract
    2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/10/2010, p.46-47
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    Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry

    Kim, Tae-Gon
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    Verdonck, Patrick  
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    Ciofi, Ivan  
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    Barbarin, Yohan
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    Tokei, Zsolt  
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    Baklanov, Mikhaïl
    Meeting abstract
    2013, 6th International Conference on Spectroscopy Ellipsometry - ICSE-VI, 26/05/2013, p.1
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    Collapse behavior and forces of multistack nanolines

    Kim, Tae-Gon
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    Wostyn, Kurt  
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    Mertens, Paul  
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    Busnaina, Ahmed A.
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    Park, Jin-Goo
    Journal article
    2010, Nanotechnology, (21) 1, p.15708
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    Collapse behavior and forces of multistack patterns

    Kim, Tae-Gon
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    Wostyn, Kurt  
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    Mertens, Paul  
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    Busnaina, Ahmed
    ;
    Park, Jin Goo
    Proceedings paper
    2008, Sematech Surface Preparation and Cleaning Conference, 31/03/2008
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    Development of post InGaAs CMP cleaning process for sub 10 nm device application

    Purushothaman, Muthukrishnan
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    Choi, In-chan
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    Kim, Hyun-Tae
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    Teugels, Lieve  
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    Kim, Tae-Gon
    Meeting abstract
    2017-10, International Conference on Planarization/CMP Technology - ICPT, 11/10/2017
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    Development of post InGaAs CMP cleaning process for sub 10nm device application

    Purushothaman, Muthukrishnan
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    Choi, In-Chan
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    Kim, Hyun-Tae
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    Teugels, Lieve  
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    Kim, Tae-Gon
    Proceedings paper
    2017-10, International Conference on Planarization/CMP Technology - ICPT, 11/10/2017
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    Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices

    Samanta, Suprakash
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    Jin, Seungwan
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    Lee, Chan-Hee
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    Lee, Seong-Soo
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    Struyf, Herbert  
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    Kim, Tae-Gon
    Journal article
    2023, MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, (161) July, p.Art. 07469
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    Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum

    Ryu, Heon-Yul
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    Teugels, Lieve  
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    Devriendt, Katia  
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    Struyf, Herbert  
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    Kim, Tae-Gon
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    Park, Jin-Goo
    Journal article
    2021, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (10) 9, p.094001
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    Effects of interfacial strength and dimension of structures on physical cleaning window

    Kim, Tae-Gon
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    Pacco, Antoine  
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    Wostyn, Kurt  
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    Xu, XiuMei  
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    Struyf, Herbert  
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    Arstila, Kai
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    Park, Jin-Goo
    Meeting abstract
    2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/10/2010, p.10-11
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    Estimation of the adhesion strength of particles/residues and gate structures for calculating the damage threshold of patterned silicon wafers during physical force assisted cleans

    Halder, Sandip  
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    Kim, Tae-Gon
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    Vos, Rita  
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    Kenis, Karine  
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    Claes, Martine  
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    De Gendt, Stefan  
    Proceedings paper
    2010, 240th ACS National Meeting, 22/08/2010
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    From confined area to wafer level nanotopography metrology solution for process developments

    Kim, Tae-Gon
    Meeting abstract
    2018, China Semiconductor Technology International Conference (CSTIC) Symposium V: CMP and Post-Polish Cleaning, 11/03/2018
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    In-line 3D AFM for critical dimension and sidewall roughness of Si photonic waveguide and correlation with its propagation loss

    Kim, Tae-Gon
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    Verheyen, Peter  
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    De Heyn, Peter  
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    Vandeweyer, Tom  
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    Miller, Andy  
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    Pantouvaki, Marianna  
    Oral presentation
    2017, International Conference on Frontiers of Characterization and Metrology for Nanoelectronics - FCMN
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    In-line atomic resolution local nanotopography variation metrology for CMP process

    Kim, Tae-Gon
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    Heylen, Nancy  
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    Kim, Soon-Wook  
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    Vandeweyer, Tom  
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    Jo, Ah-jin
    ;
    Lee, Ju Suk
    ;
    Ahn, Byoung-Woon
    Proceedings paper
    2017, International Conference on Planarization/ CMP Technology -ICPT, 11/10/2017, p.77-82
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