Browsing by Author "Kovacs, F."
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Publication A study in interactions of plasmas and wet cleans with ULK materials
;Xu, Kaidong; ; ; ; ;Kraus, HaraldHenry, Sally - AnnProceedings paper2007, 1st International Workshop Plasma Etch and Strip in Microelectronics - PESM, 10/09/2007Publication Drying of hydrophobic surfaces - one of the keys for future technologies
Meeting abstract2004, Advanced Semiconductor Manufacturing Conference - ASMC, 4/05/2004Publication Effect of plasma treatments on the compatibility of ULK to wet cleaning
;Xu, Kaidong; ; ; ;Kraus, H ;Henry, S.A. ;Archer, LGaulhofer, E.Proceedings paper2007, Proceedings of the SEMI-ECS International Semiconductor Technology Conference - ISTC, 18/03/2007Publication Etching of HfO2, deposited on LPCVD Si3N4, and cleaning of Hf residues
Oral presentation2003, Twelfth International Symposium on Semiconductor Manufacturing - ISSMPublication Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning
Journal article2005, Journal of Vacuum Science and Technology B, (23) 5, p.2160-2175Publication Measurement of nanoparticles on silicon wafer surface using haze signal by light scattering
;Xu, Kaidong; ; ; ;Kraus, H.; Vinckier, ChrisProceedings paper2005, European Aerosol Conference - EAC European Aerosol Conference 2005 (EAC2005) European Aerosol Conference 2005, 28/08/2005Publication Removing metal gate process residues
Journal article2004, European Semiconductor, (26) 4, p.61-62Publication Selective etching of SiGe for removal of dummy layers in fully silicided gate artchitectures
Proceedings paper2005, Cleaning Technology in Semiconductor Device Manufacturing IX, 17/10/2005, p.207-213Publication Selective removal of Ni for salicidation and fully silicided gates
Proceedings paper2005, Cleaning Technology in Semiconductor Device Manufacturing IX, 16/10/2005, p.67-74Publication Selective wet etching of Hf-based layers on a single-wafer spin processor
;Kraus, Harald ;Kovacs, F. ;Snow, Jim; ; ; Proceedings paper2004, Proceedings of the 3rd International Conference on Semiconductor Technology - ISTC, 15/09/2004, p.485-492