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Browsing by Author "Kwak, Dong Hwa"

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    ALD deposition of high-k and metal gate stacks for advanced CMOS applications

    Heyns, Marc  
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    Beckx, Stephan  
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    Caymax, Matty  
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    Claes, Martine  
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    De Gendt, Stefan  
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    Degraeve, Robin  
    Proceedings paper
    2004, Atomic Layer Deposition Conference, 16/08/2004
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    Correlation between stress-induced leakage current (SILC) and the HfO2 bulk trap density in a SiO2/HfO2 stack

    Crupi, Felice
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    Degraeve, Robin  
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    Kerber, Andreas
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    Kwak, Dong Hwa
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    Groeseneken, Guido  
    Proceedings paper
    2004-04, Proceedings IEEE International Reliability Physics Symposium - IRPS, 25/04/2004, p.181-187
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    High-k dielectrics integration prospects

    Kubicek, Stefan  
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    Van Elshocht, Sven  
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    Delabie, Annelies  
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    Yamamoto, Kazuhiko
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    Beckx, Stephan  
    Proceedings paper
    2005, ULSI Process Integration IV, 15/05/2005, p.169-192
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    Hot carrier degradation on n-channel SiO2/HfSiO MOSFETs: Effects on the devices performance and lifetime

    Cimino, Salvatore
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    Pantisano, Luigi
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    Aoulaiche, Marc
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    Degraeve, Robin  
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    Kwak, Dong Hwa
    Proceedings paper
    2005, 43rd Annual IEEE International Reliability Physics Symposium Proceedings, 17/04/2005, p.275-279
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    On the defect generation and low voltage extrapolation of QBD in SiO2/HfO2 stacks

    Degraeve, Robin  
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    Crupi, F.
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    Kwak, Dong Hwa
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    Groeseneken, Guido  
    Proceedings paper
    2004, Technical Digest VLSI Technology Symposium, 15/06/2004, p.140-141
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    Reliability issues in high-k stacks

    Degraeve, Robin  
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    Crupi, Felice
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    Houssa, Michel  
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    Kwak, Dong Hwa
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    Kerber, Andreas
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    Cartier, Eduard
    Proceedings paper
    2004-09, Extended Abstracts of the International Conference on Solid State Devices and Materials - SSDM, 15/09/2004, p.70-71
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    Scaling of Hf-based high-k dielectrics

    Heyns, Marc  
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    Beckx, Stephan  
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    Caymax, Matty  
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    Chen, J.
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    Claes, Martine  
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    Coenegrachts, Bart  
    Meeting abstract
    2004, International Workshop on Dielectric Thin Films for Future ULSI Devices, 26/05/2004, p.5-6

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