Browsing by Author "Lantasov, Yuri"
Now showing 1 - 8 of 8
- Results per page
- Sort Options
Publication Direct copper electroplating
Proceedings paper2000, Advanced Metallization Conference; 3-5 October 2000; San Diego, Ca, USA. To be published in 2001., p.31-31Publication Integration of electroless and electrolytic Cu and IC back end of line technologies
Proceedings paper2000, Electrochemical Technology Applications in Electronics III, 17/10/1999, p.71-79Publication Integration of electroless and electrolytic Cu in the IC back end line of technologies
Meeting abstract1999, 196th Meeting of the Electrochemical Society: 3rd Int. Symposium on Electrochemical Technology Applications in Electronics, 17/10/1999, p.903Publication Investigation on the corrosion of Cu metallization in the focused ion beam system due to a low I2 background
Proceedings paper1999, Proceedings from the 25th International Symposium for Testing and Failure Analysis, 14/11/1999, p.135-140Publication New plating bath for electroless copper deposition on sputtered barrier layers
Journal article2000, Microelectronic Engineering, (50) 1_4, p.441-447Publication New plating path for electroless copper deposition on sputtered barrier layers
Oral presentation1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.Publication The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Oral presentation1998, Advanced Metallization Conference; 6-8 Oct. 1998; Colorado Springs, USA.Publication The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Proceedings paper1999, Advanced Metallization Conference in 1998 - AMC 1998, 6/10/1998, p.65-71