Browsing by Author "Li, Hua"
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Publication A new approach for the measurement of resistivity and cross-sectional area of an aluminium interconnect line: principle and applications
Proceedings paper1998, Advanced Metallization and Interconnect Systems for ULSI Applications in 1997, 30/09/1997, p.197-204Publication Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Proceedings paper1999, Advanced Metallization Conference in 1998 - AMC 1998, 6/10/1998, p.297-303Publication Characterization of WF6/N2/H2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization
Journal article2000, J. Vacuum Science and Technology B, (B18) 1, p.242-251Publication Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)
Proceedings paper1998, Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, 13/04/1998, p.133-138Publication Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
Proceedings paper1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference, 1/06/1998, p.110-112Publication Gaseous impurities in Co silicidation - impact and solutions
Journal article2001, Journal of the Electrochemical Society, (148) 6, p.G344-G354Publication Interaction of Ti capped Co thin film with Si3N4
; ; ; Publication Materials issues of surfaces and interfaces in IC interconnections and contacts
Li, HuaPHD thesis2003-05Publication Segregation of Cu on etched and non-etched Al(Cu) surface
Proceedings paper1998, Materials Reliability in Microelectronics VIII, 13/04/1998, p.77-82Publication Thermal desorption issues related to silicidation and back-end metallization
; ; ; ; Froyen, L.Proceedings paper2000, Advanced Metallization Conference 1999 - AMC 1999, 28/09/1999, p.577-581