Browsing by Author "Matsunaga, Koichi"
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Publication Comparison of directed self-assembly integrations
Proceedings paper2012, Advances in Resist Materials and Processing Technology XXIX, 12/02/2012, p.83250GPublication Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
Meeting abstract2014, AVS 61st International Symposium and Exhibition, 9/11/2014, p.EM-TuM-6Publication EUV patterning improvement toward high-volume manufacturing
Meeting abstract2015, Extreme Ultraviolet (EUV) Lithography VI, 22/02/2015, p.94221XPublication EUV process establishment through litho and etch for N7 node
Proceedings paper2016, Extreme Ultraviolet (EUV) Lithography VII, 21/02/2016, p.97760CPublication Implementation of directed self-assembly of block copolymers in the fab for defectivity analysis
Oral presentation2012, FujiFilm Litho WorkshopPublication Implementation of self-assembly in a 300mm processing environment
Oral presentation2012, IEEE Litho WorkshopPublication Improvement of cohesion strength in ULK OSG materials by pore structure adjustment
Journal article2015, Microelectronic Engineering, 137, p.75-78Publication Latest cluster performance for EUV lithography
Proceedings paper2012, Extreme Ultraviolet (EUV) Lithography III, 12/02/2012, p.83222YPublication Manufacturability improvements in EUV resist processing towards NXE:3300 processing
Proceedings paper2014, Advances in Patterning Materials and Processes XXXI, 23/02/2014, p.905108Publication Process evaluation and optimization for EUV manufacturing
Oral presentation2012, International symposium on Extrem Ultraviolet Lithography - EUVLPublication Track processing optimizations for different EUV resist platforms: preparing for a 3300 baseline process
Proceedings paper2013, Extreme Ultraviolet (EUV) Lithography IV, 24/02/2013, p.86792TPublication Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etching
Meeting abstract2014, MRS Spring Meeting Symposium CC: New Materials and Processes for Interconnects, Novel Memory and Advanced Display Technologies, 21/04/2014, p.CC1.04