Browsing by Author "Meynen, H."
Now showing 1 - 5 of 5
- Results Per Page
- Sort Options
Publication An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
Proceedings paper2003, Proceedings of the 53rd Electronic Components and Technology Conference, 27/05/2003, p.858-863Publication Integration of low stress photopatternable silicones into a wafer level package
Proceedings paper2004-06, Proceedings of the 54th Electronic Components and Technology Conference - ECTC, 1/06/2004, p.170-174Publication Introducing a silicone under the bump configuration for stress relief in a wafer level package
Proceedings paper2003, Proceedings EPTC - Electronics Packaging Technology Conference, 11/12/2003, p.380-384Publication Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Proceedings paper2003, Proceedings of the 14th European Microelectronic Packaging Conference and Exhibition - IMAPS Europe, 23/06/2003, p.479-484Publication Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Journal article2003, Journal of the Electrochemical Society, (150) 7, p.G404-G411