Browsing by Author "Michelon, Julien"
Now showing 1 - 8 of 8
- Results Per Page
- Sort Options
Publication A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.147-151Publication Alpha-Ta formation and its impact on electromigration
Oral presentation2003, Advanced Metallization ConferencePublication Alpha-Ta formation and its impact on electromigration
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.355-359Publication Challenges in the implentation of low-k dielectrics in the back-end of line
Journal article2005, Microelectronic Engineering, 80, p.337-344Publication Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers
Publication Electromigration study of sub-100nm Cu-lines
Proceedings paper2005, Advanced Metallization Conference 2004 - AMC, p.2532-257Publication The impact of scaling on interconnect reliability
Proceedings paper2005, Proceedings 43rd IEEE International Reliability Physics Symposium, 17/04/2005, p.7-17Publication Void growth modeling upon electromigration stressing in single damascene cu lines
Journal article2007, Journal of Applied Physics, (102) 12, p.123515