Browsing by Author "Moinpour, Mansour"
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Publication Comparison of modulus and density measurements by nanoidentation, SAWS, XRR and EP techniques of a porous low k MSQ dielectric
;Abell, Thomas ;Iacopi, Francesca ;Prokopowicz, Greg ;Sun, BradMazurenko, AlexProceedings paper2005-01, Advanced Metallization Conference 2004, 19/10/2004, p.457-462Publication Composite polymer core – ceria shell abrasive particles during silicon oxide CMP
Proceedings paper2007, Advances and Challenges in Chemical Mechanical Planarization, 8/04/2007, p.C8.4Publication Composite polymer core–silica shell abrasives: effect of polishing time and slurry solid content on oxide CMP
Journal article2007, Electrochemical and Solid State Letters, (10) 9, p.H243-H247Publication Composite polymer core-silica shell abrasives: the effect of the shape of the silica particles on oxide CMP
Journal article2008, Journal of the Electrochemical Society, (155) 6, p.H401-H406Publication Composite polymer-core silica-shell abrasive particles during oxide CMP: a defectivity study
Journal article2007, Journal of The Electrochemical Society, (154) 8, p.H667-H371Publication Copper CMP with composite polymer core – silica shell abrasives: a defectivity study
Meeting abstract2008, Materials Research Society Spring Meeting Symposium N: Materials and Processes for Advanced Interconnects for Microelectronics, 23/03/2008, p.N11.4Publication Copper CMP with composite polymer core – silica shell abrasives: a defectivity study
Proceedings paper2008, Materials and Processes for Advanced Interconnects for Microelectronics, 24/03/2008, p.1079-N11-04Publication Copper CMP with composite polymer core - silica shell abrasives: A defectivity study
Journal article2009, Journal of the Electrochemical Society, (156) 1, p.H18-H26Publication Defectivity study during oxide CMP with composite polymer core – silica shell abrasives: the effect of the silica particle shape
Proceedings paper2007, CMP-MIC Conference Proceedings, 5/03/2007Publication Interaction forces between a glass surface and ceria-modified PMMA-based abrasives for CMP measured by colloidal probe AFM
Journal article2008, Journal of the Electrochemical Society, (155) 4, p.H218-H223Publication Interaction forces between a glass surface and silica-modified PMMA-based abrasives for CMP measured by Colloidal AFM
Journal article2007, Electrochemical and Solid-State Letters, (10) 2, p.H74-H78Publication Interaction forces between oxide and silica-modified terpolymer abrasive and their impact on CMP and post-CMP
Proceedings paper2008, Ultra Clean Processing of Semiconductor Surfaces VIII - UCPSS, 18/09/2006, p.169-172Publication Mixed organic/inorganic abrasive particles during oxide CMP
Journal article2008, Electrochemical and Solid-State Letters, (11) 7, p.H197-H201Publication Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing
Journal article2017, Microelectronic Engineering, 137, p.32-36Publication Oxide CMP as a test vehicle for defectivity during CMP with composite polymer core – silica shell abrasives designed for scratch reduction during Cu CMP
Proceedings paper2007, CMP-MIC Conference Proceedings, 6/03/2007