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Browsing by Author "Roelandts, Nico"

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    Comparative study of Ni-silicide and Co-silicide for sub 0.25 μm technologies

    Lauwers, A.
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    Besser, Paul  
    ;
    Gutt, T.
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    Satta, Alessandra
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    de Potter de ten Broeck, Muriel  
    Oral presentation
    1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.
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    Comparative study of Ni-silicide and Co-silicide for sub 0.25-μm technologies

    Lauwers, A.
    ;
    Besser, Paul  
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    Gutt, T.
    ;
    Satta, Alessandra
    ;
    de Potter de ten Broeck, Muriel  
    Journal article
    2000, Microelectronic Engineering, (50) 1_4, p.103-116
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    Electrical performance and scalability of Ni-monosilicide towards sub 0.13 μm technologies

    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
    ;
    Lindsay, Richard
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    Steegen, An
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    Roelandts, Nico
    Oral presentation
    2001, Symposium K of the MRS Spring Meeting: Gate Stack and Silicide Issues in Si Processing II; 16-20 April 2001; San Francisco, CA,
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    Optimized thermal processing for Ti-Capped CoSi2 for 0.13 μm technology

    Lindsay, Richard
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    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
    ;
    Roelandts, Nico
    Journal article
    2001, Microelectronic Engineering, (55) 1_4, p.157-162
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    Optimized thermal processing for Ti-capped CoSi2 for 0.13μm technology

    Lindsay, Richard
    ;
    Lauwers, A.
    ;
    de Potter de ten Broeck, Muriel  
    ;
    Roelandts, Nico
    Oral presentation
    2000, Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.
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    Performance and manufacturability of the Co/Ti (cap) silicidation process for 0.25μm MOS technologies

    Lauwers, Anne  
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    Besser, Paul  
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    de Potter de ten Broeck, Muriel  
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    Kondoh, Eiichi
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    Roelandts, Nico
    Proceedings paper
    1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference - IITC, 1/06/1998, p.99-101
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    The influence of capping layer type on cobalt salicide formation in films and narrow lines

    Besser, Paul  
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    Lauwers, Anne  
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    Roelandts, Nico
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    Maex, Karen  
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    Blum, W.
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    Alvis, R.
    ;
    Stucchi, Michele  
    Proceedings paper
    1998, Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, 13/04/1998, p.375-380

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