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Browsing by Author "Schneider, Dieter"

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    Effect of pore structure of nanometer scale porous films on the measured elastic modulus

    Vanstreels, Kris  
    ;
    Wu, Chen  
    ;
    Gonzalez, Mario  
    ;
    Schneider, Dieter
    ;
    Gidley, David
    ;
    Verdonck, Patrick  
    Journal article
    2013, Langmuir, (29) 38, p.12025-12035
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    Effect of porosity on the mechanical and fracture properties of advanced PECVD Ultralow-k SiCOH films

    Vanstreels, Kris  
    ;
    Wu, Chen  
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    Gonzalez, Mario  
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    Verdonck, Patrick  
    ;
    Martini, Roberto
    Meeting abstract
    2012, Materials for Advanced Metallization - MAM, 11/03/2012, p.O3-01
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    Intrinsic effect of porosity on the stiffness and fracture energy of nano porous ultra low-k dielectrics

    Vanstreels, Kris  
    ;
    Wu, Chen  
    ;
    Verdonck, Patrick  
    ;
    Schneider, Dieter
    ;
    Gonzalez, Mario  
    Meeting abstract
    2013, MRS Spring Meeting - Symposium AA: Advanced Interconnects for Micro- and Nanoelectronics - Materials, Processes, and Reliability, 1/04/2013, p.AA3.05
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    Spectroscopic ellipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films

    Marsik, Premysl
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    Verdonck, Patrick  
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    Schneider, Dieter
    ;
    De Roest, David  
    ;
    Kaneko, Shinya
    Journal article
    2008, Physica Status Solidi C, (5) 5, p.1253-1256
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    Stiffening and hydrophilisation of SOG low-k material studied by ellipsometric porosimetry, UV ellipsometry and laser-induced surface acoustic waves

    Urbanowicz, Adam
    ;
    Meshman, Boris
    ;
    Schneider, Dieter
    ;
    Baklanov, Mikhaïl
    Proceedings paper
    2007, 4th International Conference on Spectroscopic Ellipsometry, 11/06/2007
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    Stiffening and hydrophilisation of SOG low-k material studied by ellipsometric porosimetry, UV ellipsometry and laser-induced surface acoustic waves

    Urbanowicz, Adam
    ;
    Meshman, Boris
    ;
    Schneider, Dieter
    ;
    Baklanov, Mikhaïl
    Journal article
    2008, physica status solidi A, (205) 4, p.829-832

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