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Browsing by Author "Seefeldt, Marc"

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    Evolution of (001) and (111) facets for selective epitaxial growth inside Submicron trenches

    Jiang, Sijia
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    Merckling, Clement  
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    Guo, Weiming
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    Waldron, Niamh  
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    Caymax, Matty  
    Journal article
    2014, Journal of Applied Physics, (115) 2, p.23517
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    Growth rate for the SEG of III-V compounds inside submicron STI trenches on Si (001) substrates by MOVPE: modeling and experiments

    Jiang, Sijia
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    Merckling, Clement  
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    Guo, Weiming
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    Waldron, Niamh  
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    Caymax, Matty  
    Journal article
    2014, Journal of Crystal Growth, 391, p.59-63
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    Influence of trench width on III-V nucleation during InP selective area growth on pattern Si(001) substrate

    Jiang, Sijia
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    Merckling, Clement  
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    Guo, Weiming
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    Waldron, Niamh  
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    Moussa, Alain  
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    Caymax, Matty  
    Meeting abstract
    2014, ECS and SMEQ Joint International Meeting, 5/10/2014
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    Influence of trench width on III-V nucleation during InP selective area growth on patterned Si(001) substrates

    Jiang, Sijia
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    Merckling, Clement  
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    Moussa, Alain  
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    Guo, Weiming
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    Waldron, Niamh  
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    Collaert, Nadine  
    Proceedings paper
    2014, SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices, 5/10/2014, p.501-511
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    Nucleation behavior of III/V crystal selectively grown inside nano-trenches: the influence of trench width

    Jiang, Sijia
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    Merckling, Clement  
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    Moussa, Alain  
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    Waldron, Niamh  
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    Caymax, Matty  
    Journal article
    2015, ECS Journal of Solid State Science and Technology, (4) 7, p.N83-N87
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    Selective area growth of high quality InP on Si (001) substrates

    Wang, Gang
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    Leys, Maarten
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    Loo, Roger  
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    Richard, Olivier  
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    Bender, Hugo  
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    Waldron, Niamh  
    Journal article
    2010-09, Applied Physics Letters, (97) 12, p.121913-1
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    Selective area growth of InP and defect elimination on Si (001) substrates

    Wang, Gang
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    Leys, Maarten
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    Loo, Roger  
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    Richard, Olivier  
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    Bender, Hugo  
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    Brammertz, Guy  
    Journal article
    2011, Journal of the Electrochemical Society, (158) 6, p.H645-H650
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    Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding

    Tsau, Yan Wen
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    De Messemaeker, Joke  
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    Gonzalez, Mario  
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    Seefeldt, Marc
    ;
    Beyne, Eric  
    ;
    De Wolf, Ingrid  
    Proceedings paper
    2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023
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    Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

    Tsau, Yan Wen
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    De Messemaeker, Joke  
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    Salahouelhadj, Abdellah  
    ;
    Gonzalez, Mario  
    Journal article
    2022, MICROELECTRONICS RELIABILITY, 138, p.114716

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