Browsing by Author "Thomas, Dave"
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Publication Characterization of optical end-point detection for via reveal processing
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1181-1187Publication Comparison between wet and dry silicon via reveal in 3D backside processing
Proceedings paper2015, 12th Annual International Wafer Level Packaging Workshop - IWLPC, 13/10/2015Publication Etch process modules development and integration in 3D SOC applications
Meeting abstract2017, 10th International Workshop on Plasma Etch and Strip in Microtechnology - PESM, 19/10/2017Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
; ; ; ; ; Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.42-48Publication Extreme wafer thinning optimization for via-last applications
; ; ; ; ; Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Microfluidics on 200mm quartz substrate using semiconductor fab dry etch process as an enabler for imaging applications in life sciences
Meeting abstract2017, Micro Nano Engineering 2017, 18/09/2017, p.PO145Publication Silicon microfluidics: an enabling technology for life sciences application
Proceedings paper2017, IMAPS 50th Anniversary Symposium, 9/10/2017