Browsing by Author "Vanderstraeten, Daniel"
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Publication Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Journal article2012, Microelectronics Reliability, (52) 11, p.2677-2684Publication Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Proceedings paper2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 26/04/2010Publication Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application
Proceedings paper2005-09, Proceedings of the International Workshop on Thermal Investigations of ICs and Systems, 28/09/2005, p.173-178Publication Flip chip based packaging solution for high current driver chips used in automotive applications
Proceedings paper2008, 2nd Electronics Systemintegration Technology Conference - ESTC, 1/09/2008, p.583-588Publication Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
Proceedings paper2009-10, 15th International Workshop on Thermal Investigations of IC's and Systems - THERMINIC, 7/10/2009Publication Impact of mold compound filler particles on local thermo-mechanical stress variations
Publication Impact of PCB-housing-interaction on QFN solder joint reliability
Proceedings paper2020, 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), JUL 05-08, 2020Publication Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Proceedings paper2011-04, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 18/04/2011Publication Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Proceedings paper2019, 20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 24/03/2019, p.1-5Publication On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices
Proceedings paper2011, IEEE International Conference on IC Design and Technology - ICICDT, 2/05/2011Publication The power of green compounds for automotive
Oral presentation2010, IMAPS Benelux Seminar