Browsing by Author "Wang, Bo"
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Publication A new method to determine the internal pressure and leakage rate of MEMS packages
Proceedings paper2013, 17th International Conference on Solid-State Sensors, Actuators and Microsystems - TRANSDUCERS, 16/06/2013Publication A novel method to measure the internal pressure of MEMS thin-film packages
Journal article2013, Microelectronics Reliability, (53) 9_11, p.1663-1666Publication Comparison of three methods to measure the internal pressure of empty MEMS packages
Proceedings paper2012, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 2/07/2012Publication Design, fabrication and testing of wafer-level thin film vacuum packages for MEMS based on nanoporous alumina membranes
Journal article2013-01, Sensors and Actuators A: Physical, 189, p.218-232Publication Fast analytical design of MEMS capacitive pressure sensors with sealed cavities
Journal article2016, Mechatronics, 40, p.244-250Publication Fast analytical design of poly-SiGe MEMS pressure sensors
Proceedings paper2015, 16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 20/04/2015, p.1-4Publication Gas leak rate study of MEMS thin film package in different environments
Proceedings paper2014, 5th Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-4Publication On-Chip Light Polarization Management by Mapping the Polarization Information to Phase Shift
Journal article2023, LASER & PHOTONICS REVIEWS, (18) 1, p.Art. 2300501Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Journal article2011, Microelectronics Reliability, (51) 9_11, p.1878-1881Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Proceedings paper2012, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 2/06/2012, p.1-1Publication Poly-SiGe-based MEMS thin-film encapsulation
; ; ; Journal article2012, Journal of Microelectromechanical Systems, (110) 120, p.21-1