Browsing by Author "Wevers, Martine"
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Publication A dedicated loading instrument for characterization and testing of MEMS
Proceedings paper2005-10, Microsystem Technologies, 5/08/2005, p.538-545Publication A new characterization method for electrostatically actuated resonant MEMS: determination of the mechanical resonance frequency, quality factor and dielectric charging
Journal article2009, Sensors and Actuators A: Physical, (154) 2, p.304-315Publication A new method to determine the internal pressure and leakage rate of MEMS packages
Proceedings paper2013, 17th International Conference on Solid-State Sensors, Actuators and Microsystems - TRANSDUCERS, 16/06/2013Publication A new method to determine the mechanical resonance frequency and charging in electrostatically actuated MEMS
Proceedings paper2007-09, 18th Workshop on Micromachining, Micromechanics and Microsystems, 16/09/2007, p.329-332Publication A novel method to measure the internal pressure of MEMS thin-film packages
Journal article2013, Microelectronics Reliability, (53) 9_11, p.1663-1666Publication A spectroscopic study of the chromatic properties of GafChromic EBT3 films
Journal article2016, Medical Physics, (43) 3, p.1156-1166Publication Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency
Journal article2008, Microelectronics Reliability, (48) 8_9, p.1221-1226Publication Comparison of three methods to measure the internal pressure of empty MEMS packages
Proceedings paper2012, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 2/07/2012Publication Gas leak rate study of MEMS thin film package in different environments
Proceedings paper2014, 5th Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-4Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Journal article2011, Microelectronics Reliability, (51) 9_11, p.1878-1881Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Proceedings paper2012, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 2/06/2012, p.1-1