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Browsing by Author "Yang, H."

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    An investigation of field reduction effect on NBTI parameter characterization and lifetime prediction using a constant field stress method

    Zhou, L.
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    Bo, T.
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    Ji, Z.
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    Yang, H.
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    Xu, H.
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    Liu, Q.
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    Simoen, Eddy  
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    Wang, X.
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    Ma, X.
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    Li, Y.
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    Yin, H.
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    Du, A.
    Journal article
    2020, IEEE Transactions on Device and Materials Reliability, (20) 1, p.92-96
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    Full spectral analysis of line edge roughness

    Leunissen, Peter
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    Lorusso, Gian  
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    Ercken, Monique  
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    Croon, Jeroen
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    Yang, H.
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    Azordegan, A.
    Proceedings paper
    2005, Metrology, Inspection, and Process Control for Microlithography XIX, 28/02/2005, p.499-509
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    Impact of LER and CDU on device performance

    Leunissen, Peter
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    Lorusso, Gian  
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    Ercken, Monique  
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    Croon, Jeroen
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    Jurczak, Gosia  
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    Zhang, Wenqi
    Proceedings paper
    2005, Yield Management Solutions Seminar, 15/08/2005
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    Improved electrical and reliability characteristics of HfN/HfO2 gated nMOSFET with 0.95 nm EOT fabricated using a gate-first process

    Kang, JinFeng
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    Yu, HongYu
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    Ren, C.
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    Wang, X.P.
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    Li, M.F.
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    Chan, D.S.H.
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    Yeo, Y.C.
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    Sa, N.
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    Yang, H.
    Journal article
    2005-04, IEEE Electron Device Letters, (4) 26, p.237-239
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    Insights into the effect of TiN thickness scaling on DC and AC NBTI characteristics in replacement metal gate pMOSFETs

    Zhou, L.
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    Liu, Q.
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    Yang, H.
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    Ji, Z.
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    Xu, H.
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    Tang, B.
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    Simoen, Eddy  
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    Jiang, H.
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    Luo, Y.
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    Wang, X.
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    Ma, X.
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    Li, Y.
    Journal article
    2020, IEEE Transactions on Device and Materials Reliability, (20) 3, p.498-505
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    Mechanism of positive-bias temperature instability in sub-1 nm TaN/HfN/HfO2 gate stack with low preexisting traps

    Sa, N.
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    Kang, J.F.
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    Yang, H.
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    Liu, X.Y.
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    He, Y.D.
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    Han, R.Q.
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    Ren, C.
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    Yu, HongYu
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    Chan, D.S.H.
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    Kwong, D.-L.
    Journal article
    2005-09, IEEE Electron Device Letters, (9) 26, p.610-612
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    On-line spectral analysis of line edge roughness: algorithms qualification and transfer to etch

    Leunissen, Peter
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    Lorusso, Gian  
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    DiBiase, Tony
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    Yang, H.
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    Azordegan, A.
    Journal article
    2005, Semiconductor FabTech, 25, p.96-101
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    Scalability and reliability of TaN/HfN/HfO2 gate stack fabricated by a high temperature process

    Kang, JinFeng
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    Yu, HongYu
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    Ren, C.
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    Yang, H.
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    Sa, N.
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    Liu, X.Y.
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    Han, R.Q.
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    Li, M.F.
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    Chan, D.S.H.
    Proceedings paper
    2005, Proceedings of the 35th European Solid-State Device Research Conference - ESSDERC, p.375-378
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    The 2021 Magnonics Roadmap

    Barman, Anjan
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    Gubbiotti, Gianluca
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    Ladak, S.
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    Adeyeye, A. O.
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    Krawczyk, M.
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    Grafe, J.
    Journal article review
    2021, JOURNAL OF PHYSICS-CONDENSED MATTER, (33) 41, p.413001
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    Understanding frequency dependence of trap generation under AC negative bias temperature instability stress in Si p-FinFETs

    Zhou, L.
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    Zhang, Q.
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    Yang, H.
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    Ji, Z.
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    Zhang, Z.
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    Liu, Q.
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    Xu, H.
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    Tang, B.
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    Simoen, Eddy  
    ;
    Ma, X.
    ;
    Wang, X.
    Journal article
    2020, IEEE Electron Device Letters, (41) 7, p.965-968

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