Browsing by Author "van den Brand, Jeroen"
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Publication A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
;Mandamparambil, Rajesh ;Fledderus, Henri ;van den Brand, Jeroen ;Saalmink, MilanKusters, RoelProceedings paper2009, Proc. of the 8th annual Flexible Electronics & Display Conference, 3/02/2009Publication A conformable active matrix LED display
Proceedings paper2015, International Meeting on Information Displays, 18/08/2015Publication Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Proceedings paper2013, International Microelectronics Assembly and Packaging Society - IMAPS US, 1/10/2013Publication Bonding bare die LED's on PET foils for lighting applications: thermal design modeling and bonding experiments
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Flexible and stretchable electronics for wearable health devices
Journal article2015, Solid-State Electronics, 113, p.116-120Publication Flexible and stretchable electronics for wearable healthcare
Proceedings paper2014, 44th European Solid State Device Research Conference - ESSDERC, 22/09/2014, p.206-209Publication Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
Proceedings paper2014, Electronics System-Integration Technology Conference, 16/09/2014, p.1-5Publication Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
Proceedings paper2011, Proceedings of the 18th European Microelectronics and Packaging Conference - EMPC, 12/09/2011Publication High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
;van den Ende, Daan ;Verhoeven, Frits ;van der Eijnden, Pepijn ;Kusters, RoelSridhar, AshokProceedings paper2013, European Microelectronics Packaging Conference, 9/09/2013Publication Hybrid integration on low-cost flex foils using photonic flash soldiering
;Khoshfetrat Pakazad, Saeed ;Barink, Marco ;Arutinov, Gari ;Hendriks, RobKusters, RoelProceedings paper2016, 2016 6th Electronic System-Integration Technology Conference (ESTC), 13/09/2016, p.1-5Publication Integration techniques and applications of thin chips on low cost foil substrates
Proceedings paper2013, Smart Systems Integration, 13/03/2013Publication Large area flexible lighting foils using distributed bare LED dies on polyester substrates
Journal article2013, Microelectronics Reliability, (53) 12, p.1907-1915Publication Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
;van den Ende, Daan ;van de Wiel, H.J. ;Kusters, Roel ;Sridhar, Ashok ;Schram, JeroenJournal article2014, Microelectronics Reliability, (54) 12, p.2860-2870Publication Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication
Proceedings paper2010, Proceedings of LOPE-C, 31/05/2010Publication Novel interconnect methodologies for ultra-thin chips on foils
Proceedings paper2012, IEEE 62nd Electronic Components and Technology Conference - ECTC, 29/05/2012, p.238-244Publication Novel interconnection processes for low cost PEN/PET substrates
;van den Brand, Jeroen ;Kusters, Roel ;Fledderus, Henri ;Rubingh, Eric-JanPodprocky, TomasProceedings paper2009, 17th European Microelectronics and Packaging Conference & Exhibition - EMPC, 15/06/2009Publication Novel methodology to integrate ultra-thin chips on flexible foils
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
Journal article2014, IEEE Transactions on Components, Packaging and Manufacturing Technology, (4) 11, p.1879-1886Publication Plastic electronics based conformable electronic circuits
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012