Browsing by author "Stoukatch, Serguei"

A reliable and compact polymer-based package for capacitive RF-MEMS switches

Oya, Y.; Okubora, A.; van Spengen, Merlijn; Soussan, Philippe; Stoukatch, Serguei; Rottenberg, Xavier; Ratchev, Petar; Tilmans, Harrie; De Raedt, Walter; Beyne, Eric; De Moor, Piet; De Wolf, Ingrid; Baert, Kris (2004-12)

Active matrix vacuum fluorescent display with CdSe:In TFTS

De Vos, Alexis; Stoukatch, Serguei; De Pauw, Herbert; De Smet, Herbert; Popov, I.; Vanfleteren, Jan; Van Calster, Andre (1999)

Advanced wire bonding: bonding on copper

Ho, Meng; Lam, Kan Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, C. J.; Beyne, Eric (2002)

Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture

Okoro, Chukwudi; Eneman, Geert; Gonzalez, Mario; Vandevelde, Bart; Swinnen, Bart; Stoukatch, Serguei; Beyne, Eric; Vandepitte, Dirk (2007-05)

Bonding on Cu: a new stress evaluation approach by Raman spectroscopy

Chen, Jian; Ho, Meng; Lam, Kan Wai; Ratchev, Petar; Stoukatch, Serguei; Beyne, Eric; Vath, C.J.; De Wolf, Ingrid (2002)

Characterisation, modelling and design of bond-wire interconnects for chip-package co-design

Chandrasekhar, Arun; Stoukatch, Serguei; Brebels, Steven; Balachandran, Jayaprakash; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Podddar, Anindya (2003)

Copper wire bonding to advanced copper back-end integrated circuits

Beyne, Eric; Ho, Meng; Stoukatch, Serguei; Lam, Kan Wai; Ratchev, Petar; Degryse, Dominiek; Vath III, C.J. (2003)

Demonstration of heterogeneous integration of technologies for a Ku-band SiP Doppler radar

Sun, Xiao; Brebels, Steven; Stoukatch, Serguei; Jansen, Roelof; Dussopt, L.; Dubois, M.A.; O'Mahony, C.; Berberich, S.; Houlihan, R.; De Raedt, Walter (2008)

Direct gold and copper wires bonding on copper

Ho, Meng; Lam, Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, Charles J.; Beyne, Eric (2003)

Double and triple stacked solder joint technology for further miniaturization of 3D-SIP

Stoukatch, Serguei; Winters, Christophe; Torfs, Tom; De Raedt, Walter; Beyne, Eric; Van Hoof, Chris (2007)

Electroless nickel plating bath composition and replenishment for microvia plating process

Stoukatch, Serguei; Zhang, S.; Vanfleteren, Jan; Vereeken, Maria; Van Calster, Andre; Vandecasteele, Bjorn (2000)

Enabling technologies for antenna integration on microwave SiPs

De Raedt, Walter; Brebels, Steven; Beyne, Eric; Carchon, Geert; Stoukatch, Serguei; Vaesen, Kristof; Winters, Christophe (2004)

FCOB: packaging issues for RF-MEMS applications and reliability study

Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Ratchev, Petar; De Wolf, Ingrid; Baert, Kris; Beyne, Eric; Oya, Yoichi; Okubora, Akihiko (2005)

Fine pitch copper wire bonding on copper bond pad process optimization

Lam, Kan Wai; Ho, Meng; Stoukatch, Serguei; Ratchev, Petar; Vath, C.J.; Schervan, A.; Beyne, Eric (2002)

Flip chip assembly using SBB of high frequency GaAs modules

Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Brebels, Steven; De Raedt, Walter; Beyne, Eric (2002)

Generic RF-MEMS technology platform for mobile and satellite communications

Tilmans, Harrie; Rottenberg, Xavier; Soussan, Philippe; Nolmans, Philip; Ekkels, Phillip; Czarnecki, Piotr; Modlinski, Robert; Stoukatch, Serguei; Jourdain, Anne; Nauwelaers, Bart; Vaesen, Kristof; Carchon, Geert; De Wolf, Ingrid; De Raedt, Walter (2005)