Browsing by author "Dimcic, Biljana"
Now showing items 1-12 of 12
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Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage
Cherman, Vladimir; De Messemaeker, Joke; Croes, Kristof; Dimcic, Biljana; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Influence of the processing method on the amount and development of voids in miniaturized interconnections
Dimcic, Biljana; Labie, Riet; Zhang, Wenqi; De Wolf, Ingrid; Verlinden, Bert (2010) -
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Zhang, Wenqi; Dimcic, Biljana; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
Phase formation in Cu/Ni/Sn thin film system
Dimcic, Biljana; De Messemaeker, Joke; Zhang, Wenqi; Croes, Kristof; Vanstreels, Kris; Verlinden, Bert; De Wolf, Ingrid (2012) -
Processing and characterization of Co-Sn intermetallic compounds
O, Minho; Vakanas, George; Dimcic, Biljana; Kajihara, Masanori (2013) -
Reliability assessment of stretchable interconnect
Hsu, Yung-Yu; Dimcic, Biljana; Gonzalez, Mario; Bossuyt, Frederick; Vanfleteren, Jan; De Wolf, Ingrid (2010) -
Reliability assessment of stretchable interconnects
Hsu, Yung-Yu; Dimcic, Biljana; Gonzalez, Mario; Bossuyt, Frederick; Vanfleteren, Jan; De Wolf, Ingrid (2010) -
Reliability concerns in copper TSV's: methods and results
Croes, Kristof; Cherman, Vladimir; Li, Yunlong; Zhao, Larry; Barbarin, Yohan; De Messemaeker, Joke; Civale, Yann; Velenis, Dimitrios; Stucchi, Michele; Kauerauf, Thomas; Redolfi, Augusto; Dimcic, Biljana; Ivankovic, Andrej; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012-07)