Browsing by author "Spiess, Walter"
Now showing items 1-9 of 9
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Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
Phommahaxay, Alain; Potoms, Goedele; Verbinnen, Greet; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Donghun, Bai; Xiao, Liu; Yess, Kim; Arnold, Kim; Spiess, Walter; Griesbach, Tim; Rapps, Thomas; Lutter, Stefan (2016) -
Optimization of an advanced positive DUV photoresist towards 150 nm and beyond
Ercken, Monique; Moelants, Myriam; Vandenberghe, Geert; Goethals, Mieke; Ronse, Kurt; Masuda, Seiya; Spiess, Walter; Pawlowski, G. (1999) -
Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing
Ercken, Monique; Moelants, Myriam; Pollers, Ingrid; Van Puyenbroeck, Ilse; Goethals, Mieke; Ronse, Kurt; Pawlowski, G.; Spiess, Walter (1999) -
Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing
Ercken, Monique; Pollers, Ingrid; Van Puyenbroeck, Ilse; Goethals, Mieke; Ronse, Kurt; Pawlowski, G.; Spiess, Walter (1998) -
Optimization of an advanced positive tone DUV photoresist towards 150nm and beyond
Ercken, Monique; Moelants, Myriam; Vandenberghe, Geert; Goethals, Mieke; Ronse, Kurt; Masuda, Seiya; Spiess, Walter; Pawlowski, G. (2000) -
Process characterization of thin wafer debonding with thermoplastic materials
Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Stieber, Ralf; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012) -
Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Bex, Pieter; Van den Eede, Axel; Pancken, Joris; Lismont, Mark; Jourdain, Anne; Woitke, Tobias; Bisson, Peter; Spiess, Walter; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012) -
The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Phommahaxay, Alain; Guerrero, Alice; Kennes, Koen; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Tussing, Sebastian; Spiess, Walter; Penger, Luke; Yess, Kim; Arnold, Kim; Rapps, Thomas; Lutter, Stefan; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy; Beyer, Gerald; Radu, Iuliana; Beyne, Eric (2019) -
Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012)