Browsing by author "Ratchev, Petar"
Now showing items 1-20 of 38
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A reliable and compact polymer-based package for capacitive RF-MEMS switches
Oya, Y.; Okubora, A.; van Spengen, Merlijn; Soussan, Philippe; Stoukatch, Serguei; Rottenberg, Xavier; Ratchev, Petar; Tilmans, Harrie; De Raedt, Walter; Beyne, Eric; De Moor, Piet; De Wolf, Ingrid; Baert, Kris (2004-12) -
A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Ratchev, Petar; Loccufier, Tony; Vandevelde, Bart; Verlinden, Bert; Teliszewski, Steven; Werkhoven, Daniel; Allaert, Bart (2005) -
Advanced wire bonding: bonding on copper
Ho, Meng; Lam, Kan Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, C. J.; Beyne, Eric (2002) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Chen, Jian; Ho, Meng; Lam, Kan Wai; Ratchev, Petar; Stoukatch, Serguei; Beyne, Eric; Vath, C.J.; De Wolf, Ingrid (2002) -
Brittle to ductile fracture transition in bulk Pb-free solders
Ratchev, Petar; Vandevelde, Bart; Verlinden, B.; Allaert, B.; Werkhoven, D. (2007) -
Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Labie, Riet; Ratchev, Petar; Beyne, Eric (2005-06) -
Copper wire bonding to advanced copper back-end integrated circuits
Beyne, Eric; Ho, Meng; Stoukatch, Serguei; Lam, Kan Wai; Ratchev, Petar; Degryse, Dominiek; Vath III, C.J. (2003) -
Creep as a reliability problem in MEMS
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Jourdain, Anne; Simons, Veerle; Tilmans, Harrie; den Toonder, Jaap M.J.; Puers, Bob; De Wolf, Ingrid (2004) -
Creep as a reliability problem in MEMS
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Puers, Bob; Toonder, J.M.J; De Wolf, Ingrid (2004) -
Creep characterization of Al alloy thin films for use in MEMS applications
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Puers, Robert; den Toonder, Jaap M.J.; De Wolf, Ingrid (2004) -
Creep resistant aluminum alloys for use in MEMS
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Puers, Bob; De Wolf, Ingrid (2005) -
Die Zukunft ist bleifrei
Snoeckx, Koen; Vandevelde, Bart; Ratchev, Petar (2005-11) -
Direct gold and copper wires bonding on copper
Ho, Meng; Lam, Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, Charles J.; Beyne, Eric (2003) -
Dry oxidation mechanisms of copper in trenches
Carbonell, Laure; Ratchev, Petar; Caluwaerts, Rudy; Van Hove, Marleen; Verlinden, B.; Maex, Karen (2002) -
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Ratchev, Petar; Van De Peer, Myriam; Ho, Meng; Verlinden, B.; Bender, Hugo; De Wolf, Ingrid (2003) -
Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder
Ratchev, Petar; Vandevelde, Bart; Verlinden, Bert (2005-10) -
Elettronica verde: effetti a lungo termine
Snoeckx, Koen; Vandevelde, Bart; Ratchev, Petar (2005-03) -
FCOB: packaging issues for RF-MEMS applications and reliability study
Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Ratchev, Petar; De Wolf, Ingrid; Baert, Kris; Beyne, Eric; Oya, Yoichi; Okubora, Akihiko (2005)