Browsing by author "Limaye, Paresh"
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3D
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Beyne, Eric; Soussan, Philippe (2011) -
A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Lambrinou, Konstantza; Maurissen, Wout; Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; De Wolf, Ingrid (2009) -
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2009) -
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Van Steenberge, Nele; Limaye, Paresh; Willems, Geert; Vandevelde, Bart; Schildermans, Inge (2007) -
Challenges in the packaging of GaN-on-si devices
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-03) -
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2005-09) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Zhang, Wenqi; Limaye, Paresh; Civale, Yann; Labie, Riet; Soussan, Philippe (2010) -
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
Finite element analysis of ultra thin BGA package: first and second level reliability
Limaye, Paresh; Vandevelde, Bart; de Vries, Hans; Degryse, Dominiek; Slob, Kees; van Veen, Co; Labie, Riet (2004-05) -
High density Cu-Sn TLP bonding for 3D integration
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Ruythooren, Wouter (2009) -
Il packaging dei dispositivi GaN-on-Si
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-01) -
Influence of intermetallic properties of lead-free flip chip solder joints
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Vandepitte, Dirk; Verlinden, Bert (2008) -
Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Okoro, Chukwudi; Agarwal, Rahul; Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Beyne, Eric (2010) -
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2005) -
Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
Salenbien, R.; Cote, R.; Goossens, J.; Limaye, Paresh; Labie, Riet; Glorieux, C. (2011) -
Lead free solder joint in electronic applications: material behaviour and reliability
Limaye, Paresh (2010-01) -
Lead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations
Vandevelde, Bart; Gonzalez, Mario; Limaye, Paresh; Ratchev, Petar; Vanfleteren, Jan; Beyne, Eric (2004)