Browsing by author "Van Cauwenberghe, Marc"
Now showing items 1-11 of 11
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3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
A NEMS based sensor to monitor stress in deep sub-micron Cu/Low-$k$ interconnects
Wilson, Chris; Croes, Kristof; Van Cauwenberghe, Marc; Tokei, Zsolt; Beyer, Gerald; Horsfall, Alton; O'Neill, Anthony (2009) -
Dry etch solutions for 3D integration technology
Tutunjyan, Nina; Van Cauwenberghe, Marc; Verdonck, Patrick; Majeed, Bivragh; Buisson, Thibault; Civale, Yann; Boullart, Werner (2010) -
Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Huyghebaert, Cedric; Van Olmen, Jan; Okoro, Chukwudi; Coenen, Jens; Jourdain, Anne; Van Cauwenberghe, Marc; Agarwal, Rahul; Phommahaxay, Alain; Stucchi, Michele; Soussan, Philippe (2010) -
Failure analysis and process improvement for through silicon via interconnects
Majeed, Bivragh; Van Cauwenberghe, Marc; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2009) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson HighlandsTM chamber
Mannaert, Geert; Van Cauwenberghe, Marc; Schmidt, M.O.; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2003) -
Si recess etch for 3D stacked IC applications.
Van Cauwenberghe, Marc; Tutunjyan, Nina; Jamieson, Geraldine; Verdonck, Patrick; Huyghebaert, Cedric; Jourdain, Anne; Conard, Thierry; Boullart, Werner; Travaly, Youssef; Swinnen, Bart (2010) -
The influence of grinding and cleaning on Deep Reactive Ion Etching
Verdonck, Patrick; Van Cauwenberghe, Marc; Phommahaxay, Alain; Jamieson, Geraldine; Bogaerts, Lieve; Cotrin Teixeira, Ricardo; Huyghebaert, Cedric; Tutunjyan, Nina; Bearda, Twan; Boullart, Werner (2009) -
Thin MEMS packages obtained by a novel collective cap transfer process
Phommahaxay, Alain; Bogaerts, Lieve; Naito, Yasuyuki; Van Cauwenberghe, Marc; Tutunjyan, Nina; Onishi, Keiji; Tilmans, Harrie (2011) -
Using a biased-ICP reactor for PR strip and Cu barrier removal
Van Cauwenberghe, Marc; Mannaert, Geert; Boullart, Werner; Hendrickx, Dirk; Schmidt, M.O. (2004)