Browsing by author "Lefaucheux, P."
Now showing items 1-7 of 7
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A novel low temperature etch approach to reduce ULK plasma damage
Zhang, Liping; de Marneffe, Jean-Francois; Leroy, F.; Ljazouli, R.; Lefaucheux, P.; Tillocher, T; Dussart, R.; Maekawa, K.; Yatsuda, K.; Dussarrat, C.; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing
Dussart, R.; Lefaucheux, P.; Tillocher, T.; Ranson, P.; Boufnichel, M.; Ljazouli, R.; Zhang, Liping; Mankelevich, Y.; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013) -
Cryoetching of silicon and advanced materials for 3D interconnects
Dussart, R.; Tillocher, T.; Gosset, N; Lefaucheux, P.; L'jazouli, R; Boufnichel, M.; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Nishimura, E; Yatsuda, K; Maekawa, K (2014) -
Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis
Leroy, F; Tillocher, T; Zhang, Liping; Girard, A.; Cardinaud, C.; Lefaucheux, P.; de Marneffe, Jean-Francois; Dussart, R.; Maekawa, K; Yatsuda, K; Baklanov, Mikhaïl (2015) -
Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage
Leroy, F.; Tillocher, T.; Zhang, Liping; Lefaucheux, P.; Yatsuda, K.; Maekawa, K.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R (2015) -
Plasma cryoetching processes for silicon and advanced materials
Dussart, R.; Tillocher, T.; Gosset, N.; Vital, A; Lefaucheux, P.; L'jazouli, R; Boufnichel, M.; Vayer, M.; Sinturel, C.; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Nishimura, E.; Yatsuda, K.; Maekawa, K. (2014) -
Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process
Tillocher, T.; Leroy, F.; Zhang, Liping; Lefaucheux, P.; Yatsuda, K.; Maekawa, K.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R. (2015)