Browsing by author "Vakanas, George"
Now showing items 1-12 of 12
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Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Formation of compounds and Kirkendall vacancy in the Cu-Sn system
O, Minho; Vakanas, George; Moelans, Nele; Kajihara, Masanori; Zhang, Wenqi (2014) -
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
Mechanical characterization of micro-bump for aggressive bump scaling
Zhang, Wenqi; Mai, Zhide; Bogaerts, Lieve; Gonzalez, Mario; Vakanas, George; La Manna, Antonio; Beyne, Eric (2012) -
Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Vakanas, George; Wang, Teng; Tatsumi, Koji; Marinissen, Erik Jan; Rebibis, Kenneth June; Cherman, Vladimir; Croes, Kristof; Hua, Fay; De Wolf, Ingrid; Beyne, Eric (2014) -
Processing and characterization of Co-Sn intermetallic compounds
O, Minho; Vakanas, George; Dimcic, Biljana; Kajihara, Masanori (2013) -
Reflow process optimization for micro-bumps applications in 3D technology
Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy (2014) -
Sn whisker evaluations in 3D microbumped structures
Vakanas, George; Vandecasteele, Bjorn; Schaubroeck, David; De Messemaeker, Joke; Willems, Geert; Ashworth, Mark A.; Wilcox, Geoffrey D.; De Wolf, Ingrid (2014) -
Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
Armini, Silvia; Vandelaer, Yannick; Lesniewska, Alicja; Cherman, Vladimir; De Preter, Inge; Inoue, Fumihiro; Derakhshandeh, Jaber; Vakanas, George; Beyne, Eric (2015) -
Whisker evaluations in 3D microbump structures
Vakanas, George; Vandecasteele, Bjorn; De Messemaeker, Joke; Willems, Geert; La Manna, Antonio; Pei, Fei; Chason, Eric; Hua, Fay; De Wolf, Ingrid (2014)