Browsing by author "Marchal, Pol"
Now showing items 1-20 of 85
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3-D technology assessment: path-finding the technology/design sweet-spot
Marchal, Pol; Bougard, Bruno; Katti, Guruprasad; Stucchi, Michele; Dehaene, Wim; Papanikolaou, Antonis; Verkest, Diederik; Swinnen, Bart; Beyne, Eric (2009) -
3D heterogeneous system integration: Application driver for 3D technology development
Beyne, Eric; Marchal, Pol; Van der Plas, Geert (2011) -
3D integration or how to scale in the 21st century
Marchal, Pol (2008) -
3D integration technology basics and its impact on design
Badaroglu, Mustafa; Marchal, Pol (2010) -
3D Integration: Circuit design, test and reliability challenges
Minas, Nikolaos; De Wolf, Ingrid; Marinissen, Erik Jan; Stucchi, Michele; Oprins, Herman; Mercha, Abdelkarim; Van der Plas, Geert; Velenis, Dimitrios; Marchal, Pol (2010) -
3D IO interface design between memory and logic dies on TSV interconnects
Facchini, Marco; Marchal, Pol; Dehaene, Wim (2009) -
3D technology roadmap and status
Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011) -
3D-Integration: status, opportunities
Van der Plas, Geert; Marchal, Pol (2011) -
A calibrated pathfinding model for signal integrity analysis on interposer
Kim, Jaemin; Kim, Sunyoung; Ryckaert, Julien; Detalle, Mikael; Van Hoovels, Nele; Marchal, Pol (2012) -
A designer's perspective on future memory architectures for software defined radios
Marchal, Pol; Bougard, Bruno; Papanikolaou, Antonis; Miranda Corbalan, Miguel; Catthoor, Francky; Dehaene, Wim (2007-05) -
A practical approach to thermal modeling and validation of 3D-ICs
Cupak, Miroslav; Oprins, Herman; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Srinivasan, Adi; Cheng, Edmund (2010) -
A study of trade-offs in inter-frame compression MPEG4 for a multiprocessor platform
Portero, T.; Marchal, Pol; Gomez, J.I.; Pinuel, L.; Catthoor, Francky; Carrabina, J. (2004) -
An integrated hardware/software approach for run-time scratchpad management
Poletti, Francesco; Marchal, Pol; Atienza, David; Benini, Luca; Catthoor, Francky; Mendia, Jose M. (2004) -
An RDL-configurable 3D memory tier to replace on-chip SRAM
Facchini, Marco; Marchal, Pol; Catthoor, Francky; Dehaene, Wim (2010) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Application of substrate noise simulation methodology to 3D-stacking
Bronckers, Stephane; Van der Plas, Geert; Marchal, Pol; Rolain, Yves (2009) -
Architectures and circuits for software defined radios: scaling and scalability for low cost and low energy
Van der Perre, Liesbet; Bougard, Bruno; Craninckx, Jan; Dehaene, Wim; Hollevoet, Lieven; Jayapala, Murali; Marchal, Pol; Miranda Corbalan, Miguel; Raghavan, Praveen; Schuster, Thomas; Wambacq, Piet; Catthoor, Francky; Vanbekbergen, Peter (2007-02) -
At tape-out: can yield in terms of parametric specifications be predicted?
Papanikolaou, Antonis; Miranda Corbalan, Miguel; Marchal, Pol; Dierickx, Bart; Catthoor, Francky (2007-09) -
Automated PathFinding tool chain for 3D-stacked integrated circuits: practical case study
Milojevic, Dragomir; Carlson, Trevor; Croes, Kris; Radojcic, Riko; Ragett, D.F.; Seynhaeve, D.; Van der Plas, Geert; Marchal, Pol (2009-09) -
Bygg tredimensionellt
Provoost, Jan; Marchal, Pol (2011-12)