Browsing by author "Christiaens, Filip"
Now showing items 1-20 of 28
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A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package
Christiaens, Filip; Vandevelde, Bart; Beyne, Eric; Mertens, Robert; Bergmans, J. (1998) -
CIMID, A technology for high density integration of electronic systems
Beyne, Eric; Van Hoof, Rita; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, Jan; Heermann, M.; Gouwy, G.; Bulcke, P. (1994) -
Compact transient thermal models for the polymer stud grid array (PSGATM) package
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jef; Heerman, M.; Berghmans, J. (1997) -
Das Stud-Grid-Array - eine kostengünstige Lösung für den Einbau vielpoliger ICs
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, J.; Dumoulin, A.; Boone, L.; Meerman, H. (1996) -
Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique
Christiaens, Filip; Vandevelde, Bart; Beyne, Eric; Roggen, Jean (1996) -
Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Temmerman, W.; Nelemans, W.; Lauwers, E.; Allaert, K. (1997) -
Experimental thermal characterisation of electronic packages in a fluid bath environment
Christiaens, Filip; Beyne, Eric; Temmerman, W.; Allaert, K.; Nelemans, W. (1997) -
Improved solder joint reliability in polymer stud grid array packages by structural design optimisation
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Van Puymbroeck, J.; Heerman, M. (1996) -
Measurement circuits for transient thermal characterization of power transistors and transformers
Glinianowicz, Jacek; Christiaens, Filip; Beyne, Eric; Staszak, Z. J. (1994) -
Modeling of thermal vias in thin film multichip modules
Christiaens, Filip; Beyne, Eric; Berghmans, J. (1994) -
Modelling of thermal vias in high density interconnection structures
Christiaens, Filip; Beyne, Eric; Berghmans, J. (1994) -
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (1997) -
Parametric compact models for flip chip assemblies
Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D. (1999) -
Parametric compact models for flip chip assemblies
Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D. (2000) -
Simulation of solder joint reliability for CBGA packages
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Roose, Erik; Corlatan, D. (2001) -
The Plastic Stud Grid Array, a low cost solution for packaging and assembling high pin count devices
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, Jan; Dumoulin, A.; Boone, L.; Heerman, M. (1995) -
The polymer stud grid array package
Beyne, Eric; Vandevelde, Bart; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, J.; Boone, L.; Heerman, M. (1996) -
The polymer stud grid array package
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, J.; Boone, L.; Heerman, M. (1996) -
The stud grid array, a low cost solution for packaging and assembling high pin count devices
Beyne, Eric; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, Jan; Dumoulin, A.; Boone, L.; Heerman, M. (1995) -
The Submerged Double Jet Impingement (SDJI) method for thermal testing of packages
Driessens, Evelien; Christiaens, Filip (2001)