Browsing by author "Ruythooren, Wouter"
Now showing items 21-40 of 94
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Cu electrodeposition for Through-Silicon Via Technology
Philipsen, Harold; Luhn, Ole; Sabuncuoglu Tezcan, Deniz; Civale, Yann; Ruythooren, Wouter (2009) -
Cu plating of through-Si vias for 3D-stacked integrated circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2008) -
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Cu-Cu bonding alternative to solder based micro-bumping
Ruythooren, Wouter; Beltran Amenabar, Amaia; Labie, Riet (2007) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Iker, Francois; Funaya, Takuo; Cotrin Teixeira, Ricardo; Ruythooren, Wouter (2009) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
Electric and magnetic FEM modeling strategies for micro-inductors
Driesen, J.; Ruythooren, Wouter; Belmans, Ronnie; De Boeck, Jo; Celis, Jean-Pierre; Hameyer, K. (1999) -
Electrodeposited CoP: structural and magnetic properties
Ruythooren, Wouter; de Wit, E.; De Boeck, Jo; Celis, Jean-Pierre (2000) -
Electrodeposited CoP: structural and magnetic properties
Ruythooren, Wouter; de Wit, E.; De Boeck, Jo; Celis, Jean-Pierre (2001) -
Electrodeposition for the synthesis of microsystems
Ruythooren, Wouter; Attenborough, Karen; Beerten, Steven; Merken, Patrick; Fransaer, J.; Beyne, Eric; Van Hoof, Chris; De Boeck, Jo; Celis, Jean-Pierre (1999) -
Electrodeposition for the synthesis of microsystems
Ruythooren, Wouter; Attenborough, Karen; Beerten, Steven; Merken, Patrick; Fransaer, J.; Beyne, Eric; Van Hoof, Chris; De Boeck, Jo; Celis, Jean-Pierre (2000) -
Establishing solder interconnects in capillary die-to-substrate self-assembly
Mastrangeli, Massimo; Ruythooren, Wouter; Van Hoof, Chris; Celis, Jean-Pierre (2008) -
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Flip chip mounting for improved thermal management of AlGaN/GaN HFETs
Ji, Hangfeng; Sarua, A.; Kuball, Martin; Das, Johan; Ruythooren, Wouter; Germain, Marianne; Borghs, Gustaaf (2005) -
GaN for RF power amplifier : challenges and opportunities from material to System-in-a-Package
Germain, Marianne; Das, Johan; Derluyn, Joff; Vandersmissen, Raf; De Raedt, Walter; Schreurs, Dominique; Ruythooren, Wouter; Xiao, Dongping; Borghs, Gustaaf (2005) -
High density Cu-Sn TLP bonding for 3D integration
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Ruythooren, Wouter (2009) -
High electron mobility in AlGaN/GaN HEMT grown on sapphire: strain modification by means of AlN interlayers
Germain, Marianne; Leys, Maarten; Boeykens, Steven; Degroote, Stefan; Wang, Wenfei; Schreurs, Dominique; Ruythooren, Wouter; Choi, Kang-Hoon; Van Daele, B.; Van Tendeloo, G.; Borghs, Gustaaf (2004-12) -
High performance GaN field-effect-transistors grown by MOVPE with in-situ Si3N4 surface passivation
Germain, Marianne; Derluyn, Joff; Xiao, Dongping; Vandersmissen, Raf; Das, Johan; Wang, Wenfei; Boeykens, Steven; Leys, Maarten; Degroote, Stefan; Ruythooren, Wouter; Borghs, Gustaaf (2004) -
Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
Das, Johan; Ruythooren, Wouter; Vandersmissen, Raf; Oprins, Herman; Derluyn, Joff; Germain, Marianne; Borghs, Gustaaf (2005)