Browsing by author "Soussan, Philippe"
Now showing items 21-40 of 126
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All-Silicon Photodetectors for Photonic Integrated Circuit Calibration
Dwivedi, Sarvagya Paavan; Kjellman, Jon; Kongnyuy, Tangla David; Prost, Mathias; Marinins, Aleksandrs; Soussan, Philippe; Dahlem, Marcus; Rottenberg, Xavier; Jansen, Roelof (2020) -
An IC-centric biocompatible chip encapsulation fabrication process
Op de Beeck, Maaike; La Manna, Antonio; Buisson, Thibault; Dy, Eric; Velenis, Dimitrios; Axisa, Fabrice; Soussan, Philippe; Van Hoof, Chris (2010) -
Calibration-free Si-SiN optical phased array
Dwivedi, Sarvagya Paavan; Tyagi, Hemant Kumar; Marinins, Aleksandrs; Kongnyuy, Tangla David; Kerman, Sarp; Kjellman, Jon; Figeys, Bruno; Prost, Mathias; Seema Saseendran, Sandeep; Soussan, Philippe; Dahlem, Marcus; Rottenberg, Xavier; Jansen, Roelof (2019) -
Chip embedding by spin-on-dielectrics
Duval, Fabrice; Soussan, Philippe; Detalle, Mikael; Beyne, Eric (2012) -
Chip ultra-thinning and embedding technology for autonomous sensors array applications
Muller, Philippe; Iker, Francois; Soussan, Philippe; Beyne, Eric; Carchon, Geert; De Raedt, Walter (2009) -
Class 3 HBM and class C MM ESD protected 5.5 GHz LNA in 90 nm RF CMOS using above-IC inductors
Thijs, Steven; Linten, Dimitri; Mahadeva Iyer, Natarajan; Jeamsaksiri,; Mercha, Abdelkarim; Ramos, Javier; Sun, Xiao; Carchon, Geert; Soussan, Philippe; Wambacq, Piet; Decoutere, Stefaan; Groeseneken, Guido (2005) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS-integrated MEMS and photonic sensors for application in pico-satellites
Rottenberg, Xavier; Rochus, Veronique; Jansen, Roelof; Ray Chaudhuri, Ashesh; Helin, Philippe; Severi, Simone; Du Bois, Bert; Brondani Torri, Guilherme; Claes, Tom; Neutens, Pieter; Van Dorpe, Pol; Lambrechts, Andy; Soussan, Philippe; Deshpande, Paru; Donnay, Stephane; De Moor, Piet; Tilmans, Harrie (2014) -
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Mercha, Abdelkarim; Van der Plas, Geert; Moroz, V.; De Wolf, Ingrid; Asimakopoulos, Panagiotis; Minas, Nikolaos; Domae, Shinichi; Perry, Dan; Choi, M.; Redolfi, Augusto; Okoro, Chukwudi; Yang, Yu; Van Olmen, Jan; Thangaraju, Sarasvathi; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Cho, Jong Hoon; Yakovlev, A.; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Soussan, Philippe; Huyghebaert, Cedric; Phommahaxay, Alain (2010-12) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Deep-level transient spectroscopy of GaAs nanoridge diodes grown on Si substrates
Syshchyk, Olga; Hsu, Brent; Yu, Hao; Motsnyi, Vasyl; Vais, Abhitosh; Kunert, Bernardette; Mols, Yves; Alcotte, Reynald; Puybaret, Renaud; Waldron, Niamh; Soussan, Philippe; Boulenc, Pierre; Karve, Gauri; Simoen, Eddy; Collaert, Nadine; Puers, Bob; Van Hoof, Chris (2020) -
Densely Integrated Phase Interrogators for Low-Complexity On-Chip Calibration of Optical Phased Arrays
Kjellman, Jon; Prost, Mathias; Marinins, Aleksandrs; Tyagi, Hemant Kumar; Kongnyuy, Tangla David; Dwivedi, Sarvagya Paavan; Dahlem, Marcus; Soussan, Philippe; Rottenberg, Xavier; Jansen, Roelof (2022) -
Design and fabrication of a surface micromachined frequency tunable film bulk acoustic resonator with an extended electrostatic tuning range
Pan, Wanling; Soussan, Philippe; Nauwelaers, Bart; Tilmans, Harrie (2005) -
Design and integration technology for miniature medical microsystems
Van Hoof, Chris; Pereira Neves, Hercules; Aarts, Arno; Iker, Francois; Soussan, Philippe; Gonzalez, Mario; Beyne, Eric; Vanfleteren, Jan; Puers, Bob; De Moor, Piet (2008) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric (2009) -
Dual-layer thick LPCVD SiN waveguides for low-loss photonics on 200 mm wafers
Marinins, Aleksandrs; Kjellman, Jon; Caer, Charles; Kongnyuy, Tangla David; Rottenberg, Xavier; Jansen, Roelof; Soussan, Philippe (2021)