Browsing by author "Philipsen, Harold"
Now showing items 21-40 of 68
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Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Electroless Cu seed on Ru and Co liners in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Van Huylenbroeck, Stefaan; van der Veen, Marleen; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014) -
Electroless Rhodium Deposition for Metallization of Advanced Interconnects
Philipsen, Harold; Viviani, Prisca (2021) -
Electrolithic Memory: A New Device for Ultrahigh-Density Data Storage
Fransen, Senne; Willems, Kherim; Philipsen, Harold; Verreck, Devin; Van Roy, Wim; Henry, Olivier; Arreghini, Antonio; Van den Bosch, Geert; Furnemont, Arnaud; Rosmeulen, Maarten (2022) -
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Front side metallization of silicon solar cells by Copper-platingaP
Hernandez, Jose Luis; Aleman, Monica; Allebe, Christophe; Bearda, Twan; John, Joachim; Kuzma Filipek, Izabela; Philipsen, Harold; Posthuma, Niels; Prajapati, Victor; Rodet, Simon; Poortmans, Jef (2010-04) -
Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014) -
Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Immersion and electrochemical deposition of Ru on Si
Philipsen, Harold; Monnens, Wouter (2018) -
Impact of oxide liner properties on TSV Cu pumping and TSV stress
De Messemaeker, Joke; Varela Pedreira, Olalla; Moussa, Alain; Nabiollahi, Nabi; Vanstreels, Kris; Van Huylenbroeck, Stefaan; Philipsen, Harold; Verdonck, Patrick; Vandevelde, Bart; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof (2015) -
Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
De Messemaeker, Joke; Varela Pedreira, Olalla; Vandevelde, Bart; Philipsen, Harold; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof (2013) -
Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
Influence of chemical additives on the surface reactivity of Si in KOH solution
Philipsen, Harold; Kelly, John J. (2009) -
Investigation of chemical mechanical planarization (CMP) and post-CMP cleanig for Molybdenum
Harada, Ken; Philipsen, Harold; Teugels, Lieve; Struyf, Herbert (2019) -
Investigation of copper plated contacts for silicon solar cells
Posthuma, Niels; Hernandez, Jose Luis; Lazov, Vladimir; Philipsen, Harold; Prajapati, Victor; Janssens, Tom; Van Kerschaver, Emmanuel; Poortmans, Jef (2009) -
Large area copper plated silicon solar cell exceeding 19.5% efficiency
Tous, Loic; Russell, Richard; Das, Jo; Labie, Riet; Ngamo, Michel; Horzel, Jörg; Philipsen, Harold; Sniekers, Jeroen; Vandersmissen, Kevin; van den Brekel, Lukas; Janssens, Tom; Aleman, Monica; van Dorp, Dennis; Poortmans, Jef; Mertens, Robert (2012) -
Light-induced electrochemical deposition of Ni for Si solar cell processing
van Dorp, Dennis; Sniekers, Jeroen; Bonneux, Gilles; Tous, Loic; Russell, Richard; Szlufcik, Jozef; Philipsen, Harold (2014) -
Liquid Memory and the Future of Data Storage
Rosmeulen, Maarten; Lockhart de la Rosa, Cesar Javier; Willems, Kherim; Fransen, Senne; Shih, Bing-Yang; Verreck, Devin; Kalangi, Vasu; Yasin, Farrukh; Philipsen, Harold; Set, Ying Ting; Ronchi, Nicolo; Van Roy, Wim; Henry, Olivier; Arreghini, Antonio; Van den Bosch, Geert; Furnemont, Arnaud (2022)