Browsing by author "Simons, Veerle"
Now showing items 21-31 of 31
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Impact of thinning and packaging on a deep sub-micron CMOS product
Perry, Dan; Ray, Urmi; Gu, Sam; Nakamoto, Mark; Sy, Wing; Wang, Kevin; Ruythooren, Wouter; Yang, Yu; De Wolf, Ingrid; Cotrin Teixeira, Ricardo; Gonzalez, Mario; Simons, Veerle; Berry, Christopher J.; Lee, KiWook; Burggraf, Jürgen; Pargfrieder, Stefan (2009) -
In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
De Wolf, Ingrid; Simons, Veerle; Cherman, Vladimir; Labie, Riet; Vandevelde, Bart; Beyne, Eric (2012) -
Nanoscale selective silicon nanowires surface functionalization for sensing applications
Armini, Silvia; Carli, Marta; Snauwaert, Johan; Cherman, Vladimir; De Wolf, Ingrid; Simons, Veerle; Maestre Caro, Arantxa; Moonens, Jos; Neutens, Pieter; Arstila, Kai; Ogi, J.; Oda, S.; Tsuchiya, Yoshi; Mizuta, Hiroshi (2010) -
On the electrical activity of misfit and threading dislocations in P-N junctions fabricated in thin strain-relaxed buffer layers
Simoen, Eddy; Eneman, Geert; Shamuilia, Sheron; Simons, Veerle; Gaubas, E.; Delhougne, Romain; Loo, Roger; De Meyer, Kristin; Claeys, Cor (2005) -
On the scalability of source/drain current enhancement in thin film sSOI
Augendre, Emmanuel; Eneman, Geert; De Keersgieter, An; Simons, Veerle; De Wolf, Ingrid; Ramos, Javier; Brus, Stephan; Pawlak, Bartek; Severi, Simone; Leys, Frederik; Sleeckx, Erik; Locorotondo, Sabrina; Ercken, Monique; de Marneffe, Jean-Francois; Fei, Lu; Seacrist, Mike; Kellerman, Bruce; Goodwin, Michael; Jurczak, Gosia; Biesemans, Serge (2005) -
P+/N junction formation in thin strain relaxed buffer strained silicon substrates: the effect of the junction anneal
Eneman, Geert; Simoen, Eddy; Delhougne, Romain; Verheyen, Peter; Simons, Veerle; Loo, Roger; Caymax, Matty; De Meyer, Kristin; Vandervorst, Wilfried; Claeys, Cor (2005) -
Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
De Wolf, Ingrid; Simons, Veerle; Lofrano, Melina; Cherman, Vladimir; De Vos, Joeri; Van der Plas, Geert; Beyne, Eric (2014-09) -
Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects
Absil, Philippe; Croes, Kristof; De Heyn, Peter; Ban, Yoojin; Snyder, Brad; De Coster, Jeroen; Balakrishnan, Sadhishkumar; Lepage, Guy; Golshani, Negin; Verheyen, Peter; Pantouvaki, Marianna; Van Campenhout, Joris; Fodor, Ferenc; Lesniewska, Alicja; Simons, Veerle; Lardenois, Sebastien; Detalle, Mikael; Chen, Hongtao; Miller, Andy; Loo, Roger; Vanherle, Wendy (2017) -
Residual stress in silicon caused by Cu-Sn wafer-level packaging
Taklo, Maaike; Vardĝy, Astrid-Sofie; De Wolf, Ingrid; Simons, Veerle; van de Wiel, H.J.; van der Waal, Adri; Martinsen, Stian; Lapadatu, Adriana; Wunderle, Bernhard (2013) -
Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015) -
Understanding EM-degradation mechanisms in metal heaters used for Si Photonics applications
Croes, Kristof; Simons, Veerle; Cherman, Vladimir; Oprins, Herman; Absil, Philippe; Glabman, Aaron; Eric, Wilcox (2019)