Browsing by title

W versus Co–Al as gate fill-metal for aggressively scaled replacement high-k/metal gate devices for (Sub-)22nm technology nodes

Veloso, Anabela; Chew, Soon Aik; Schram, Tom; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Tielens, Hilde; Heylen, Nancy; Devriendt, Katia; Sebaai, Farid; Brus, Stephan; Ragnarsson, Lars-Ake; Pantisano, Luigi; Eneman, Geert; Carbonell, Laure; Richard, Olivier; Favia, Paola; Geypen, Jef; Bender, Hugo; Higuchi, Yuichi; Phatak, Anup; Thean, Aaron; Horiguchi, Naoto (2013)

W vs. Co-Al as gate fill-metal for aggressively scaled replacement high-k/metal gate devices for (Sub-)22nm technology nodes

Veloso, Anabela; Chew, Soon Aik; Schram, Tom; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Tielens, Hilde; Heylen, Nancy; Devriendt, Katia; Sebaai, Farid; Brus, Stephan; Ragnarsson, Lars-Ake; Pantisano, Luigi; Eneman, Geert; Carbonell, Laure; Richard, Olivier; Favia, Paola; Geypen, Jef; Bender, Hugo; Higuchi, Yuichi; Phatak, Anup; Thean, Aaron; Horiguchi, Naoto (2012-09)

W-band high-gain amplifier using InP dual-gate HEMT technology

van der Zanden, Koen; Baeyens, Yves; Van Hove, Marleen; Schreurs, Dominique; De Raedt, Walter; Van Rossum, Marc (1997)

W-band millimeter wave artificial magnetic conductor realization by grounded frequency selective surfaces

Islam, S.; Stiens, J.; Poesen, G.; Jaeger, I.; Koers, G.; Vounckx, Roger (2007)

W-band speckle contrast images for inspection of concealed objects

Jaeger, I.; Zhang, L.; Stiens, J.; Sahli, Hichem; Vounckx, Roger (2007)

W2W permanent stacking for 3D system integration

Peng, Lan; Kim, Soon-Wook; Soules, Michael; Gabriel, Markus; Zoberbier, Margarete; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric (2014)

Wachsender Markt fur Mikrosensoren und -Aktoren

Verhaegen, Katarina (1999)

Wafer alignment mark placement accuracy impact on the layer to layer overlay performance

van Haren, Richard; Steinert, Steffen; Mouraille, Orion; D'have, Koen; Van Dijk, Leon; Hermans, Jan; Beyer, Dirk (2019)

Wafer and simulations study comparing 5 LELE decomposition algorithms for both compliant and non-compliant lay-outs

Fenger, Germain; La Cour, Pat; Tritchkov, Alex; Komirenko, Sergiy; Wiaux, Vincent (2009)

Wafer backside cleaning strategies for high-k/metal gate processing

Vos, Rita; Kesters, Els; Garaud, Sylvain; De Waele, Rita; Kenis, Karine; Lux, Marcel; Kraus, Harald; Snow, Jim; Shamiryan, Denis; Catana, Gabriela; Deweerd, Wim; Schram, Tom; De Gendt, Stefan; Mertens, Paul (2004)

Wafer backside cleaning strategies for high-k/metal gate processing

Vos, Rita; Kesters, Els; Garaud, Sylvain; De Waele, Rita; Kenis, Karine; Lux, Marcel; Kraus, Harald; Snow, Jim; Shamiryan, Denis; Catana, Gabriela; Deweerd, Wim; Schram, Tom; De Gendt, Stefan; Mertens, Paul (2005)

Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch

Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter (2012)

Wafer based aberration metrology for lithographic systems using overlay measurements on targets imaged from phase-shift gratings

van Haver, Sven; Coene, Wim M.J.; D'have, Koen; Geypen, Niels; Van Adrichem, Paul; de Winter, Laurens; Janssen, Augustus J.E.M.; Cheng, Shaunee (2014)