Browsing Conference contributions by imec author "247af4929b75543d804745c4cdcf40cb5bb1b30f"
Now showing items 21-40 of 63
-
High resolution infrared imagers enabled by QD pixels
Malinowski, Pawel; Georgitzikis, Epimitheas; Pejovic, Vladimir; Moreno Hagelsieb, Luis; Uytterhoeven, Griet; Lee, Jiwon; Li, Yunlong; Thijs, Steven; Verschooten, Tom; Lim, Myung jin; Lieberman, Itai; Cheyns, David (2020) -
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Roda Neve, Cesar; Detalle, Mikael; Nolmans, Philip; Li, Yunlong; De Vos, Joeri; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2016) -
Image sensors for low cost infrared imaging and 3D sensing
Lee, Jiwon; Georgitzikis, Epimitheas; Van Sieleghem, Edward; Chang, Yun Tzu; Syshchyk, Olga; Li, Yunlong; Karve, Gauri; Furxhi, Orges; Cheyns, David; Malinowski, Pawel (2020) -
Imaging in Short-Wave Infrared with 1.82 mu m Pixel Pitch Quantum Dot Image Sensor
Lee, Jiwon; Georgitzikis, Epimitheas; Li, Yunlong; Lin, Ziduo; Park, Jihoon; Lieberman, Itai; Cheyns, David; Jayapala, Murali; Lambrechts, Andy; Thijs, Steven; Stahl, Richard; Malinowski, Pawel (2020) -
Impact of backside process on high aspect ratio via-middle Cu through silicon via reliability
Li, Yunlong; Van Huylenbroeck, Stefaan; De Vos, Joeri; Stucchi, Michele; Croes, Kristof; Beyer, Gerald; Beyne, Eric (2017-06) -
Impact of barrier integrity on liner reliability in 3D through silicon vias
Li, Yunlong; Civale, Yann; Oba, Yoshiyuki; Cockburn, Andrew; Park, Jin Hee; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2013) -
Impact of Cu TSVs on BEOL metal and dielectric reliability
Li, Yunlong; Croes, Kristof; Nabiollahi, Nabi; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Velenis, Dimitrios; Bender, Hugo; Jourdain, Anne; Pantouvaki, Marianna; Stucchi, Michele; Vanstreels, Kris; Van De Peer, Myriam; De Messemaeker, Joke; Wu, Chen; Beyer, Gerald; De Wolf, Ingrid; Beyne, Eric (2014) -
Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
Kirimura, Tomoyuki; Croes, Kristof; Li, Yunlong; Demuynck, Steven; Wilson, Chris; Lofrano, Melina; Tokei, Zsolt (2012-04) -
Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification
Suhard, Samuel; Li, Yunlong; Iwasaki, Akihisa; Van Huylenbroeck, Stefaan; Draper, Simon; Mizutani, Atsushi; Dory, Thomas; Holsteyns, Frank (2016) -
Integration and electrical characterization of carbon nanotube bundles for application as interconnects
Chiodarelli, Nicolo; Arstila, Kai; Li, Yunlong; Cott, Daire; Richard, Olivier; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2010) -
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
Croes, Kristof; Li, Yunlong; Lofrano, Melina; Wilson, Chris; Tokei, Zsolt (2013) -
Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability
Li, Yunlong; Tokei, Zsolt; Roussel, Philippe; Groeseneken, Guido; Maex, Karen (2005) -
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
Jacobs, Kristof J.P.; Li, Yunlong; Van Huylenbroeck, Stefaan; De Wolf, Ingrid; Beyne, Eric (2019) -
Low field TDDB of BEOL interconnects using >40 months of data
Croes, Kristof; Roussel, Philippe; Barbarin, Yohan; Wu, Chen; Li, Yunlong; Boemmels, Juergen; Tokei, Zsolt (2013) -
Low-k dielectric reliability: impact of test structure choice, copper and integrated dielectric quality
Tokei, Zsolt; Li, Yunlong; Ciofi, Ivan; Croes, Kristof; Beyer, Gerald (2008) -
Miniaturization of NIR/SWIR image sensors enabled by thin-film photodiode monolithic integration
Furxhi, Orges; Malinowski, Pawel; Lee, Jiwon; Li, Yunlong; Georgitzikis, Epimitheas; Pejovic, Vladimir; Lieberman, Itai; Verschooten, Tom; Thijs, Steven; Heremans, Paul; Cheyns, David (2021) -
Moisture related low-k dielectric reliability before and after thermal annealing
Li, Yunlong; Ciofi, Ivan; Carbonell, Laure; Groeseneken, Guido; Maex, Karen; Tokei, Zsolt (2007) -
Monolithically integrated quantum-dot based image sensor for low cost high resolution NIR/SWIR applications
Lee, Jiwon; Boulenc, Pierre; Georgitzikis, Epimitheas; Li, Yunlong; Malinowski, Pawel; Cheyns, David; Guerrieri, Stefano (2019) -
New breakdown mechanism investigation: barrier metal penetration induced soft breakdown in low-k dielectrics
Wu, Chen; Li, Yunlong; Boemmels, Juergen; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2016) -
New insights into metal drift induced failure in MOL and BEOL
Wu, Chen; Varela Pedreira, Olalla; Lesniewska, Alicja; Li, Yunlong; Ciofi, Ivan; Tokei, Zsolt; Croes, Kristof (2018)