Browsing Conference contributions by imec author "31bc2924ec63747723dfcf06d7b182d39bc7949e"
Now showing items 41-54 of 54
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Outperformance of Cu pillar flip chip bumps in electromigration testing
Labie, Riet; Dosseul, Franck; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Beyne, Eric; Vandevelde, Bart (2011) -
Physics of failure based quantification of life time for electronics board assemblies
Vandevelde, Bart; Labie, Riet; Zanon, Franco; Willems, Geert (2017-06) -
Progress in i-Module: Towards improved performance, reliability and module-level fabrication technologies for back-contact PV modules based on ultra-thin silicon solar cells
Govaerts, Jonathan; Labie, Riet; Granata, Stefano; Gonzalez, Mario; O'Sullivan, Barry; Vanleenhove, Anja; Wera, Jan; Gougam, Adel; Kumar, Arul; Bearda, Twan; Beaucarne, Guy; van der Heide, Arvid; Dewallef, Stefan; Vanfleteren, Jan; Gordon, Ivan; Baert, Kris (2011) -
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Vandevelde, Bart; Labie, Riet; Degrendele, Lieven; Cauwe, Maarten; De Baets, Johan; Willems, Geert (2014-05) -
Reliability challenges during different phases of 3D SIC processing
Croes, Kristof; Civale, Yann; Labie, Riet; Li, Yunlong; De Messemaeker, Joke; Vanstreels, Kris; Redolfi, Augusto; Velenis, Dimitrios; Varela Pedreira, Olalla; Van De Peer, Myriam; Cherman, Vladimir; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2012) -
Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
Labie, Riet; Limaye, Paresh; Lee, K.W.; Berry, C.J.; Beyne, Eric; De Wolf, Ingrid (2010) -
Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking
Labie, Riet; Ruythooren, Wouter; Baert, Kris; Beyne, Eric; Swinnen, Bart (2008) -
Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies
Selim, Ramsey; Hoofman, Romano; Labie, Riet; Sandeep, Veda; Drischel, Thomas; Torki, Kholdoun (2021-07-02) -
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Dudek, Rainer; Gromala, Przemyslaw; Eichorst, Michael (2023) -
The i-module approach: Towards improved performance and reliability of photovoltaic modules
Govaerts, Jonathan; Labie, Riet; Hernandez, Jose Luis; Gonzalez, Mario; Beaucarne, Guy; Dewallef, Stefan; van der Heide, Arvid; Vanfleteren, Jan; Gordon, Ivan; Baert, Kris (2011) -
Thermo-mechanical challenges of advanced solar cell modules
Gonzalez, Mario; Govaerts, Jonathan; Labie, Riet; De Wolf, Ingrid; Baert, Kris (2011) -
Through-silicon via and die stacking technologies for microsystems-integration
Beyne, Eric; De Moor, Piet; Ruythooren, Wouter; Labie, Riet; Jourdain, Anne; Tilmans, Harrie; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Swinnen, Bart; Cartuyvels, Rudi (2008) -
Verifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
Marchal, Pol; Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Cherman, Vladimir; Oprins, Herman; Labie, Riet; Vandevelde, Bart; Travaly, Youssef; Beyne, Eric (2010) -
Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Allaert, Bart; Lauwaert, Ralf; Vanhee, Filip; Pissoort, Davy; De Wolf, Ingrid; Mehner, Jan (2018-04)