Browsing Conference contributions by imec author "a127bab792ab3028898bd66f15356bfc06e63b89"

Now showing items 21-32 of 32

    • Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects 

      Absil, Philippe; Croes, Kristof; De Heyn, Peter; Ban, Yoojin; Snyder, Brad; De Coster, Jeroen; Balakrishnan, Sadhishkumar; Lepage, Guy; Golshani, Negin; Verheyen, Peter; Pantouvaki, Marianna; Van Campenhout, Joris; Fodor, Ferenc; Lesniewska, Alicja; Simons, Veerle; Lardenois, Sebastien; Detalle, Mikael; Chen, Hongtao; Miller, Andy; Loo, Roger; Vanherle, Wendy (2017)

    • Role of defects in the reliability of HfO2/Si-based spacer dielectric stacks for local interconnects 

      Wu, Chen; Vaisman Chasin, Adrian; Padovani, Andrea; Lesniewska, Alicja; Demuynck, Steven; Croes, Kristof (2019)

    • Scaled TaN barriers for Cu interconnects: reliability performance 

      Varela Pedreira, Olalla; Lesniewska, Alicja; Jourdan, Nicolas; Vega Gonzalez, Victor; Lariviere, Stephane; van der Veen, Marleen; Croes, Kristof; Tokei, Zsolt (2019)

    • Silicon photonics for 56G NRZ optical interconnects 

      Van Campenhout, Joris; Ban, Yoojin; De Heyn, Peter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Snyder, Brad; Balakrishnan, Sadhishkumar; Lepage, Guy; Golshani, Negin; Janssen, Sofie; Lesniewska, Alicja; Croes, Kristof; Miller, Andy; Verheyen, Peter; Pantouvaki, Marianna; Absil, Philippe (2018)

    • Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium 

      Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)

    • Testing the limits of TaN barrier scaling 

      Witt, Christian; Yeap, K.B.; Lesniewska, Alicja; Wan, Danny; Jourdan, Nicolas; Ciofi, Ivan; Wu, Chen; Tokei, Zsolt (2018)

    • Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability 

      Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015)

    • Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps 

      Armini, Silvia; Vandelaer, Yannick; Lesniewska, Alicja; Cherman, Vladimir; De Preter, Inge; Inoue, Fumihiro; Derakhshandeh, Jaber; Vakanas, George; Beyne, Eric (2015)

    • Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node 

      Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019)

    • Toward successful integration of gap-filling ultralow-k dielectrics 

      Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Tokei, Zsolt; Boemmels, Juergen; Lefferts, S.; De Gendt, Stefan; Baklanov, Mikhaïl (2016)

    • Towards accurate temperature prediction in BEOL for reliability assessment (Invited) 

      Lofrano, Melina; Oprins, Herman; Chang, Xinyue; Vermeersch, Bjorn; Lesniewska, Alicja; Cherman, Vladimir; Ciofi, Ivan; Croes, Kristof; Park, Seongho; Tokei, Zsolt; Varela Pedreira, Olalla (2023)

    • Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18 

      Marti, Giulio; Pokhrel, Ankit; Murdoch, Gayle; Delie, Gilles; Gupta, Anshul; Marien, Philippe; Lesniewska, Alicja; Decoster, Stefan; Kundu, Souvik; Le, Quoc Toan; Oniki, Yusuke; Kenens, Bart; Hermans, Yannick; Park, Seongho; Tokei, Zsolt (2023)