Browsing Conference contributions by author "Cadacio Jr., Francisco"
Now showing items 1-5 of 5
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An alternative 3D packaging route thru wafer reconstruction
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015) -
Evaluation of mechanical stress induced during IC packaging
Cherman, Vladimir; Lofrano, Melina; Gonzalez, Mario; Cadacio Jr., Francisco; Rebibis, Kenneth June; Beyne, Eric; Takano, Akihito; Higashi, Mitsutoshi (2018) -
Low warpage wafer level transfer molding post 3D die to wafer assembly
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Potoms, Goedele; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Gal, Wilfred; Zijl, Jurrian; Kersjes, Sebastiaan; Wensink, Henk (2016) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015)