Browsing Conference contributions by imec author "dfef90a5cc9853e542c56c798ca862233dd6279e"
Now showing items 21-40 of 56
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Fat damascene wires for high bandwidth routing in silicon interposer
Detalle, Mikael; Kim, Jaemin; Nolmans, Philip; Sun, Xiao; Ryckaert, Julien; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization
Zhang, Wenqi; La Manna, Antonio; Soussan, Philippe; Beyne, Eric (2012) -
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
High density 20μm pitch CuSn microbump process for high-end 3D applications
De Vos, Joeri; Jourdain, Anne; Erismis, Mehmet Akif; Zhang, Wenqi; De Munck, Koen; La Manna, Antonio; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2011) -
High strength, polymer microneedles for transdermal drug delivery
Paul Chaudhuri, Buddhadev; Ceyssens, Frederik; Guan, Tiannan; La Manna, Antonio; Pereira Neves, Hercules; Van Hoof, Chris; Puers, Bob (2011) -
In-tier diagnosis of power domains in 3D TSV ICs
Araga, Yuuki; Nagata, Makoto; Van der Plas, Geert; Kim, Jaemin; Minas, Nikolaos; Marchal, Pol; Travaly, Youssef; Libois, Michael; La Manna, Antonio; Zhang, Wenqi; Beyne, Eric (2012) -
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Buisson, Thibault; Potoms, Goedele; Phommahaxay, Alain; Verbinnen, Greet; Jaenen, Patrick; La Manna, Antonio; Travaly, Youssef; Beyne, Eric (2011) -
Integration of a 3D microwave module
Sun, Xiao; Soussan, Philippe; La Manna, Antonio; Majeed, Bivragh; De Raedt, Walter (2010) -
Interposer technology for high band width interconnect applications
Detalle, Mikael; La Manna, Antonio; De Vos, Joeri; Nolmans, Philip; Daily, Robert; Beyer, Gerald; Beyne, Eric (2013) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Mechanical characterization of micro-bump for aggressive bump scaling
Zhang, Wenqi; Mai, Zhide; Bogaerts, Lieve; Gonzalez, Mario; Vakanas, George; La Manna, Antonio; Beyne, Eric (2012) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Minimizing interposer warpage by process control and design optimization
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; De Messemaeker, Joke; Gonzalez, Mario; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2014) -
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Zhang, Wenqi; Dimcic, Biljana; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe; Beyne, Eric (2011) -
Out-of-plane, high strength, polymer microneedles for transdermal drug delivery
Paul Chaudhuri, Buddhadev; Ceyssens, Frederik; Pereira Neves, Hercules; La Manna, Antonio; Van Hoof, Chris; Puers, Bob (2011) -
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014) -
Process development to enable die sorting and 3D IC stacking
La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12) -
Process developments for 3D-IC integration
La Manna, Antonio (2014) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12)