Recently added

Ultra-Dense III-V-on-Silicon Nitride Frequency Comb Laser

Cuyvers, Stijn; Haq, Bahawal; Op de Beeck, Camiel; Poelman, Stijn; Hermans, Artur; Wang, Zheng; Roelkens, Gunther; Van Gasse, Kasper; Kuyken, Bart (2020)

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride photonic integrated circuits

Goyvaerts, Jeroen; Kumari, Sulakshna; Uvin, Sarah; Zhang, Jing; Baets, Roel; Gocalinska, Agnieszka; Pelucchi, Emanuele; Corbett, Brian; Roelkens, Gunther (2020)

Towards Ultra-Low-Latency mmWave Wi-Fi for Multi-User Interactive Virtual Reality

Struye, Jakob; Lemic, Filip; Famaey, Jeroen (2020)

Unsupervised Machine Learning Techniques for Network Intrusion Detection on Modern Data

Verkerken, Miel; D'hooge, Laurens; Wauters, Tim; Volckaert, Bruno; De Turck, Filip (2020)

Towards Slot Bonding for Adaptive MCS in IEEE 802.15.4e TSCH Networks

Daneels, Glenn; Delgado, Carmen; Latre, Steven; Famaey, Jeroen (2020)

SRFog: A flexible architecture for Virtual Reality content delivery through Fog Computing and Segment Routing

Pereira dos Santos, José Pedro; van der Hooft, Jeroen; Torres Vega, Maria; Wauters, Tim; Volckaert, Bruno; De Turck, Filip (2021)

Towards delay-aware container-based Service Function Chaining in Fog Computing

Pereira dos Santos, José Pedro; Wauters, Tim; Volckaert, Bruno; De Turck, Filip (2020)

Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture

Sun, Chen; Liang, Jie; Xu, Haiwen; Kong, Eugene; Nguyen, Bich-Yen; Vandooren, Anne; Schwarzenbach, Walter; Maleville, Christophe; Barral, Vincent; Berthelon, Remy; Weber, Olivier; Arnaud, Franck; Thean, Aaron V. Y.; Gong, Xiao (2020)

Tightening the Mesh Size of the Cell-Aware ATPG Net for Catching All Detectable Weakest Faults

Hu, Min-Chun; Gao, Zhan; Malagi, Santosh; Swenton, Joe; Huisken, Jos; Goossens, Kees; Wu, Cheng-Wen; Marinissen, Erik Jan (2020)

Threshold plasticity of hybrid Si-V0(2) microring resonators

Wang, Zhi; Li, Qiang; Fu, Ziling; Katumba, Andrew; Denis-le Coarer, Florian; Rontani, Damien; Sciamanna, Marc; Bienstman, Peter (2020)

Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substrates

Magnani, Alessandro; Cosnier, Thibault; Amirifar, Nooshin; Zhao, Ming; Li, Xiangdong; Geens, Karen; Decoutere, Stefaan (2020)

Thermal Aspects of Silicon Photonic Interposer Packages

Oprins, Herman; Ban, Yoojin; Cherman, Vladimir; Van Campenhout, Joris (2020)

THE RADON TRANSFORM FOR TERAHERTZ COMPUTED TOMOGRAPHY INCORPORATING THE BEAM SHAPE

Lumbeeck, Lars; Paramonov, Pavel; Sijbers, Jan; De Beenhouwer, Jan (2020)

The mask contribution as part of the intra-field on-product overlay performance

van Haren, Richard; Steinert, Steffen; Mouraille, Orion; Hermans, Jan; van Dijk, Leon; Beyer, Dirk (2020)

The Influence of Gate Bias on the Anneal of Hot-Carrier Degradation

Vandemaele, Michiel; Chuang, Kai-Hsin; Bury, Erik; Tyaginov, Stanislav; Groeseneken, Guido; Kaczer, Ben (2020)

Scaled transistors with 2D materials from the 300mm fab

Asselberghs, Inge; Schram, Tom; Smets, Quentin; Groven, Benjamin; Brems, Steven; Phommahaxay, Alain; Cott, Daire; Dupuy, Emmanuel; Radisic, Dunja; de Marneffe, Jean-Francois; Thiam, Arame; Li, Waikin; Devriendt, Katia; Gaur, Abhinav; Verreck, Devin; Maurice, Thibaut; Lin, Dennis; Morin, Pierre; Radu, Iuliana (2020)

High Q factor and high transmittance suspended membrane THz PhC cavity: experimental demonstration for sensing applications

Akiki, Elias; Verstuyft, Mattias; Ducournau, Guillaume; Walter, Benjamin; Kuyken, Bart; Lampin, Jean-Francois; Vanwolleghem, Mathias; verstuyft (2020)

10.1109/ESTC48849.2020.9229662

Shang, Xiaobing; Chen, Fang; Chen, Zihao; De Smet, Herbert; Li, Hongqiang; Jiang, Changjun (2020)

Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB

Mirdamadi, S. Hossein; Derakhshandeh, Jaber; Cochet, Tom; Beyne, Eric; Beyer, Gerald; Miller, Andy; mirda (2020)

VITAL-5G: Innovative Network Applications (NetApps) Support over 5G Connectivity for the Transport & Logistics Vertical

Trichias, Konstantinos; Landi, Giada; Seder, Erin; Marquez-Barja, Johann; Frizzell, Ronan; Iordache, Marius; Demestichas, Panagiotis (2021)

Conference contributions: Recent submissions

Ultra-Dense III-V-on-Silicon Nitride Frequency Comb Laser ﻿

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride photonic integrated circuits ﻿

Towards Ultra-Low-Latency mmWave Wi-Fi for Multi-User Interactive Virtual Reality ﻿

Unsupervised Machine Learning Techniques for Network Intrusion Detection on Modern Data ﻿

Towards Slot Bonding for Adaptive MCS in IEEE 802.15.4e TSCH Networks ﻿

SRFog: A flexible architecture for Virtual Reality content delivery through Fog Computing and Segment Routing ﻿

Towards delay-aware container-based Service Function Chaining in Fog Computing ﻿

Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture ﻿

Tightening the Mesh Size of the Cell-Aware ATPG Net for Catching All Detectable Weakest Faults ﻿

Threshold plasticity of hybrid Si-V0(2) microring resonators ﻿

Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substrates ﻿

Thermal Aspects of Silicon Photonic Interposer Packages ﻿

THE RADON TRANSFORM FOR TERAHERTZ COMPUTED TOMOGRAPHY INCORPORATING THE BEAM SHAPE ﻿

The mask contribution as part of the intra-field on-product overlay performance ﻿

The Influence of Gate Bias on the Anneal of Hot-Carrier Degradation ﻿

Scaled transistors with 2D materials from the 300mm fab ﻿

High Q factor and high transmittance suspended membrane THz PhC cavity: experimental demonstration for sensing applications ﻿

10.1109/ESTC48849.2020.9229662 ﻿

Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB ﻿

VITAL-5G: Innovative Network Applications (NetApps) Support over 5G Connectivity for the Transport & Logistics Vertical ﻿