Recently added

A new DfT standard on the horizon: IEEE Std P1838 for 3D test access

Marinissen, Erik Jan; McLaurin, Teresa (2018-05)

Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits

Marinissen, Erik Jan; Fodor, Ferenc; Podpod, Arnita; Stucchi, Michele; Jian, Yu-Rong; Wu, Cheng-Wen (2018-11)

Gallium-doped SiGe and Ge via MO-RPCVD epitaxy

Margetis, Joe; Porret, Clément; Kumar, Raj; Petersen Barbosa Lima, Lucas; Kohen, David; Loo, Roger; Tolle, John (2018-05)

Traitor tracing after visible watermark removal

Mareen, Hannes; De Praeter, Johan; Van Wallendael, Glenn; Lambert, Peter (2018-01)

A novel video watermarking approach based on implicit distortions

Mareen, Hannes; De Praeter, Johan; Van Wallendael, Glenn; Lambert, Peter (2018-01)

Performance and memory use trade-off in CPU and GPU implementations of a deformation operator for 4D-CT

Manhaeve, Stijn; Van Nieuwenhove, Vincent; Sijbers, Jan (2018)

Optimization methodology for reconfigurable PV modules

Manganiello, Patrizio; Bosmalis, Pavlos; Baka, Maro; Voroshazi, Eszter; Soudris, Dimitrios; Catthoor, Francky; Szlufcik, Jozef; Poortmans, Jef (2018)

Integration of ball lens in through-package via to enable photonic chip-to-board coupling

Mangal, Nivesh; Missinne, Jeroen; Van Campenhout, Joris; Van Steenberge, Geert; Snyder, Brad (2018)

Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

Mangal, Nivesh; Missinne, Jeroen; Roelkens, Gunther; Van Campenhout, Joris; Van Steenberge, Geert; Snyder, Brad (2018)

Variability analysis of a boost converter based on an iterative and decoupled circuit implementation of the stochastic Galerkin method

Manfredi, Paolo; Trinchero, Riccardo; Vande Ginste, Dries (2018)

EUVL Gen 2.0: Key requirements for constraining semiconductor cost in advanced technology node manufacturing

Mallik, Arindam; Debacker, Peter; McIntyre, Greg; Kim, Ryan Ryoung han; Ronse, Kurt (2018)

New display applications enabled by high resolution OLED frontplane

Malinowski, Pawel; Ke, Tung Huei; Nakamura, Atsushi; Cheyns, David; Vander Velpen, Dieter; Vandenplas, Erwin; Myny, Kris; Akkerman, Hylke; Kronemeijer, Auke; van der Steen, Jan-Laurens; Steudel, Soeren; Gelinck, Gerwin; Heremans, Paul (2018)

Thin-film photodetectors enabling infrared CMOS image sensors

Malinowski, Pawel; Georgitzikis, Epimitheas; Pejovic, Vladimir; Suss, Andreas; Guerrieri, Stefano; Maes, Jorick; Gielen, Sam; Hens, Zeger; Maes, Wouter; Heremans, Paul; Cheyns, David (2018)

Transparent IO access control for application-level tenant isolation

Makki, Majid; Van landuyt, Dimitri; Lagaisse, Bert; Joosen, Wouter; Hofstede, Nick (2018)

Advancing X-ray metrology for routine thin film analysis

Makhotkin, Igor; Fathabad, Zahra; Yakunin, Sergey; van de Kruijs, Robbert; Philipsen, Vicky; Luong, Vu; Bijkerk, Fred (2018)

Integration of Tungsten micro-heaters and polymer microfluidic for the cell sorting application

Majeed, Bivragh; Van Acker, Lut; de Wijs, Koen; Liu, Chengxun (2018)

Source number estimation for multi-speaker localisation and tracking

Madhu, Nilesh; Martin, R. (2018-09)

MAC protocol for supporting multiple roaming users in multi-cell UWB localization networks

Macoir, Nicola; Ridolfi, Matteo; Rossey, Jen; Moerman, Ingrid; De Poorter, Eli (2018-06)

Fully-automatic inverse tone mapping preserving the content creator's artistic intentions

Luzardo, Gonzalo; Aelterman, Jan; Luong, Hiep; Philips, Wilfried; Ochoa, Daniel; Rousseaux, Sven (2018)

Optimal forgeries against polynomial-based MACs and GCM

Luykx, A.; Preneel, Bart (2018)

Conference contributions: Recent submissions

A new DfT standard on the horizon: IEEE Std P1838 for 3D test access ﻿

Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits ﻿

Gallium-doped SiGe and Ge via MO-RPCVD epitaxy ﻿

Traitor tracing after visible watermark removal ﻿

A novel video watermarking approach based on implicit distortions ﻿

Performance and memory use trade-off in CPU and GPU implementations of a deformation operator for 4D-CT ﻿

Optimization methodology for reconfigurable PV modules ﻿

Integration of ball lens in through-package via to enable photonic chip-to-board coupling ﻿

Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics ﻿

Variability analysis of a boost converter based on an iterative and decoupled circuit implementation of the stochastic Galerkin method ﻿

EUVL Gen 2.0: Key requirements for constraining semiconductor cost in advanced technology node manufacturing ﻿

New display applications enabled by high resolution OLED frontplane ﻿

Thin-film photodetectors enabling infrared CMOS image sensors ﻿

Transparent IO access control for application-level tenant isolation ﻿

Advancing X-ray metrology for routine thin film analysis ﻿

Integration of Tungsten micro-heaters and polymer microfluidic for the cell sorting application ﻿

Source number estimation for multi-speaker localisation and tracking ﻿

MAC protocol for supporting multiple roaming users in multi-cell UWB localization networks ﻿

Fully-automatic inverse tone mapping preserving the content creator's artistic intentions ﻿

Optimal forgeries against polynomial-based MACs and GCM ﻿