Recently added

Investigating the effect of soiling on the power production of PV panels exposed to wind: wind tunnel approach

Lundholm, Rickard; Goossens, Dirk; Goverde, Hans; Poortmans, Jef; Chowdhury, Gofran; Govaerts, Jonathan (2018)

Integrated dielectric scatterers for fast optical classification of biological cells

Lugnan, Alessio; Dambre, Joni; Bienstman, Peter (2018)

Integrated dielectric scatterers for speeding up classification of cell diffraction patterns

Lugnan, Alessio; Dambre, Joni; Bienstman, Peter (2018)

Effects of grain boundaries on the electronic properties of MoS2 layers

Ludwig, Jonathan; Chiappe, Daniele; Mascaro, Marco; Celano, Umberto; Asselberghs, Inge; Radu, Iuliana; van der Heide, Paul; Vandervorst, Wilfried; Paredis, Kristof (2018)

The need for LWR metrology standardization: the imec roughness protocol

Lorusso, Gian; Sutani, Takeyoshi; Rutigliani, Vito; Van Roey, Frieda; Moussa, Alain; Charley, Anne-Laure; Mack, Chris; Naulleau, Patrick; Constantoudis, Vassilios; Ikota, Masami; Ishimoto, Toru; Koshihara, S (2018)

Epitaxial GeSn: impact of process conditions on material quality

Loo, Roger; Shimura, Yosuke; Ike, Shinichi; Vohra, Anurag; Stoica, Toma; Buca, Dan; Kohen, David; Margetis, Joe; Tolle, John (2018-05)

Epitaxial growth schemes for Fin and Gate-All-Around devices

Loo, Roger; Hikavyy, Andriy; Rosseel, Erik; Porret, Clément; Vohra, Anurag; Kohen, David; Margetis, Joe; Tolle, John; Langer, Robert (2018-05)

Epitaxial growth schemes for fin and Gate All Around devices

Loo, Roger; Hikavyy, Andriy; Rosseel, Erik; Porret, Clément; Vohra, Anurag; Kohen, David; Margetis, Joe; Tolle, John; Langer, Robert (2018)

Epitaxial growth of Group IV semiconductors

Loo, Roger; Hikavyy, Andriy; Porret, Clément; Rosseel, Erik; Vohra, Anurag; Langer, Robert (2018-12)

WiSH-WalT: A framework for controllable and reproducible LoRa testbeds

Lome, Q.; Dublé, E.; Rousseau, F.; Moerman, Ingrid; Giannoulis, Spilios; Duda, A. (2018-09)

Micro-transfer printing for advanced scalable hybrid photonic integration

Loi, R.; Roycroft, B.; O'Callaghan, J.; Justice, J.; Gocalinska, A.; Peluchi, E.; Trindade, A.J.; Bower, C.A.; Roelkens, Gunther; Corbett, B. (2018)

An investigation of thermo-mechanical stress in IC's induced during chip assembly

Lofrano, Melina; Gonzalez, Mario; Cherman, Vladimir; Beyne, Eric (2018)

Low loss high refractive index niobium oxide waveguide platform for visible light applications

Lodewijks, Kristof; Jayachandran, Suseendran; Kongnyuy, Tangla David; Lenci, Silvia; Das, Sayantan; Van Dorpe, Pol; Humbert, Aurelie; Jansen, Roelof; Severi, Simone; Rottenberg, Xavier (2018-06)

Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid

Liu, Yong; Derakhshandeh, Jaber; Gao, Yao; Rebibis, Kenneth June; De Wolf, Ingrid; Li, Pei (2018)

In-situ investigation of the impact of externally applied vertical stress on III-V bipolar transistor

Liu, Yefan; Hiblot, Gaspard; Gonzalez, Mario; Vanstreels, Kris; Velenis, Dimitrios; Badaroglu, Mustafa; Van der Plas, Geert; De Wolf, Ingrid (2018)

Investigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system

Liu, Yefan; Hiblot, Gaspard; Gonzalez, Mario; De Wolf, Ingrid (2018)

A 28-GHz transceiver front-end with T/R switching achieving 11.2-dBm OP1dB, 33.8% PAEmax and 4-dB NF in 22-nm FD-SOI for 5G communication

Liu, Yao; Mangraviti, Giovanni; Shinya, Hitomi; Khalaf, Khaled; Debaillie, Bjorn; Wambacq, Piet (2018)

Conference contributions: Recent submissions

Investigating the effect of soiling on the power production of PV panels exposed to wind: wind tunnel approach

Integrated dielectric scatterers for fast optical classification of biological cells

Integrated dielectric scatterers for speeding up classification of cell diffraction patterns

Effects of grain boundaries on the electronic properties of MoS2 layers

The need for LWR metrology standardization: the imec roughness protocol

Epitaxial GeSn: impact of process conditions on material quality

Epitaxial growth schemes for Fin and Gate-All-Around devices

Epitaxial growth schemes for fin and Gate All Around devices

Epitaxial growth of Group IV semiconductors

WiSH-WalT: A framework for controllable and reproducible LoRa testbeds

Micro-transfer printing for advanced scalable hybrid photonic integration

An investigation of thermo-mechanical stress in IC's induced during chip assembly

Low loss high refractive index niobium oxide waveguide platform for visible light applications

Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid

In-situ investigation of the impact of externally applied vertical stress on III-V bipolar transistor

Investigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system

A 28-GHz transceiver front-end with T/R switching achieving 11.2-dBm OP1dB, 33.8% PAEmax and 4-dB NF in 22-nm FD-SOI for 5G communication

Using deep learning and radio virtualisation for efficient spectrum sharing among coexisting networks

Selective wet etching in fabricating SiGe and Ge nanowires for gate-all-around MOSFETs

Top-pinned STT-MRAM devices with high thermal stability hybrid free layers for high density memory applications

Conference contributions: Recent submissions

Investigating the effect of soiling on the power production of PV panels exposed to wind: wind tunnel approach ﻿

Integrated dielectric scatterers for fast optical classification of biological cells ﻿

Integrated dielectric scatterers for speeding up classification of cell diffraction patterns ﻿

Effects of grain boundaries on the electronic properties of MoS2 layers ﻿

The need for LWR metrology standardization: the imec roughness protocol ﻿

Epitaxial GeSn: impact of process conditions on material quality ﻿

Epitaxial growth schemes for Fin and Gate-All-Around devices ﻿

Epitaxial growth schemes for fin and Gate All Around devices ﻿

Epitaxial growth of Group IV semiconductors ﻿

WiSH-WalT: A framework for controllable and reproducible LoRa testbeds ﻿

Micro-transfer printing for advanced scalable hybrid photonic integration ﻿

An investigation of thermo-mechanical stress in IC's induced during chip assembly ﻿

Low loss high refractive index niobium oxide waveguide platform for visible light applications ﻿

Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid ﻿

In-situ investigation of the impact of externally applied vertical stress on III-V bipolar transistor ﻿

Investigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system ﻿

A 28-GHz transceiver front-end with T/R switching achieving 11.2-dBm OP1dB, 33.8% PAEmax and 4-dB NF in 22-nm FD-SOI for 5G communication ﻿

Using deep learning and radio virtualisation for efficient spectrum sharing among coexisting networks ﻿

Selective wet etching in fabricating SiGe and Ge nanowires for gate-all-around MOSFETs ﻿

Top-pinned STT-MRAM devices with high thermal stability hybrid free layers for high density memory applications ﻿

Investigating the effect of soiling on the power production of PV panels exposed to wind: wind tunnel approach

Integrated dielectric scatterers for fast optical classification of biological cells

Integrated dielectric scatterers for speeding up classification of cell diffraction patterns

Effects of grain boundaries on the electronic properties of MoS2 layers

The need for LWR metrology standardization: the imec roughness protocol

Epitaxial GeSn: impact of process conditions on material quality

Epitaxial growth schemes for Fin and Gate-All-Around devices

Epitaxial growth schemes for fin and Gate All Around devices

Epitaxial growth of Group IV semiconductors

WiSH-WalT: A framework for controllable and reproducible LoRa testbeds

Micro-transfer printing for advanced scalable hybrid photonic integration

An investigation of thermo-mechanical stress in IC's induced during chip assembly

Low loss high refractive index niobium oxide waveguide platform for visible light applications

Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid

In-situ investigation of the impact of externally applied vertical stress on III-V bipolar transistor

Investigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system

A 28-GHz transceiver front-end with T/R switching achieving 11.2-dBm OP1dB, 33.8% PAEmax and 4-dB NF in 22-nm FD-SOI for 5G communication

Using deep learning and radio virtualisation for efficient spectrum sharing among coexisting networks

Selective wet etching in fabricating SiGe and Ge nanowires for gate-all-around MOSFETs

Top-pinned STT-MRAM devices with high thermal stability hybrid free layers for high density memory applications